Technology Challenges: Intel, IBM, Xilinx, GlobalFoundries, IMEC
I spent the day at the SEMI Industry Strategy Symposium in Half Moon Bay. The early part of the day was devoted to technology challenges. Obviously everyone did not say exactly the same things, and had a little bit of a different spin depending on what business they are in. But there was a lot of commonality between Intel, IBM, Xilinx and GlobalFoundries. There were also presentations by the Global450mm Consortium and from Handel Jones of IBS. I will cover what they said in separate blogs later in the week.
Firstly, everyone pretty much agrees that there are no insurmountable technical challenges getting to 7nm. We know how to do it. Or at least we know what we have to do to get there, and it is engineering rather than basic research.
To read the full article, click here
Related Semiconductor IP
- Network-on-Chip (NoC)
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- UCIe PHY (Die-to-Die) IP
- UCIe-S 64GT/s PHY IP
- UA Link DL IP core
Related Blogs
- TSMC vs GlobalFoundries vs IBM
- Xilinx announces first stacked silicon interconnect technology
- TSMC vs GlobalFoundries IBM Samsung
- 28nm-SLP technology - The Superior Low Power, GHz Class Mobile Solution
Latest Blogs
- Design specification: The cornerstone of an ASIC collaboration
- The importance of ADCs in low-power electrocardiography ASICs
- VESA Adaptive-Sync V2 Operation in DisplayPort VIP
- Design, Verification, and Software Development Decisions Require a Single Source of Truth
- CAVP-Validated Post-Quantum Cryptography