Technology Challenges: Intel, IBM, Xilinx, GlobalFoundries, IMEC
I spent the day at the SEMI Industry Strategy Symposium in Half Moon Bay. The early part of the day was devoted to technology challenges. Obviously everyone did not say exactly the same things, and had a little bit of a different spin depending on what business they are in. But there was a lot of commonality between Intel, IBM, Xilinx and GlobalFoundries. There were also presentations by the Global450mm Consortium and from Handel Jones of IBS. I will cover what they said in separate blogs later in the week.
Firstly, everyone pretty much agrees that there are no insurmountable technical challenges getting to 7nm. We know how to do it. Or at least we know what we have to do to get there, and it is engineering rather than basic research.
To read the full article, click here
Related Semiconductor IP
- Bluetooth Low Energy 6.0 Digital IP
- Ultra-low power high dynamic range image sensor
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- Digital PUF IP
Related Blogs
- TSMC vs GlobalFoundries vs IBM
- Xilinx announces first stacked silicon interconnect technology
- TSMC vs GlobalFoundries IBM Samsung
- 28nm-SLP technology - The Superior Low Power, GHz Class Mobile Solution
Latest Blogs
- SiFive Celebrates 10 Years as Your Trusted Partner for RISC-V IP Innovation
- MIPI: Powering the Future of Connected Devices
- ESD Protection for an High Voltage Tolerant Driver Circuit in 4nm FinFET Technology
- Designing the AI Factories: Unlocking Innovation with Intelligent IP
- Smarter SoC Design for Agile Teams and Tight Deadlines