Can Sub-Arctic Temperature Circuits Solve the AI Energy Challenge?
The AI era is fostering unprecedented innovation across industries and creating acute challenges for the high-performance computing (HPC) industry to support exponential power and performance demands. AI alone is poised to increase data center power demand by 160 percent by 2030, as queries from applications like ChatGPT require nearly 10X the electricity to process as a Google search. The HPC ecosystem is exploring new semiconductor designs to unlock next-generation infrastructures that deliver greater performance and energy efficiency. One promising area of semiconductor research looks to answer the question, “Can sub arctic-cold, microscopic circuits = a more energy efficient AI data center?” Enter – cryogenic CMOS.
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- MIPI SoundWire I3S Peripheral IP
- LPDDR6/5X/5 Controller IP
- Post-Quantum ML-KEM IP Core
- MIPI SoundWire I3S Manager IP
Related Blogs
- ReRAM-Powered Edge AI: A Game-Changer for Energy Efficiency, Cost, and Security
- Bluetooth set as short range wireless standard for smart energy!
- ARM A Huge Challenge For Intel
- The Chip Challenge For Japan
Latest Blogs
- ML-DSA explained: Quantum-Safe digital Signatures for secure embedded Systems
- Efficiency Defines The Future Of Data Movement
- Why Standard-Cell Architecture Matters for Adaptable ASIC Designs
- ML-KEM explained: Quantum-safe Key Exchange for secure embedded Hardware
- Rivos Collaborates to Complete Secure Provisioning of Integrated OpenTitan Root of Trust During SoC Production