One-on-One with Lip-Bu Tan
Monday was Lip-Bu's turn for a chat with Ed Sperling. The same event last year was billed as a "fireside chat" but was postponed for 15 minutes when a spotlight really did catch fire. Taking no chances, this year it was re-branded as a one-on-one chat, and the spotlights obliged by not bursting into flames.
Ed started with a softball question about which markets are going to be hot. Lip-Bu gave the stock answer (mobile, automotive, IoT, HPC), but emphasized that there isn't something on the horizon on the scale of mobile with literally billions of units per year shipping. But he sees lots of opportunity and disruption in cloud datacenter infrastructure due to big data. Adding data from cars to hyperscale web services and it's huge. Lip-Bu is excited about the whole semiconductor industry.
To read the full article, click here
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Bluetooth Low Energy 6.0 Digital IP
- MIPI SWI3S Manager Core IP
- Ultra-low power high dynamic range image sensor
- Neural Video Processor IP
Related Blogs
- DAC Vision from Cadence's Lip-Bu Tan
- Enabling the Global 800G Ecosystem with 112G Ethernet PHY IP
- Keeping Up with UCIe 1.1 Verification Using Synopsys VIP for UCIe
- Addressing Multi-Physics Effects for High-Performing Multi-Die Systems with Integrated Die/Package Co-Design Platform
Latest Blogs
- Breaking the Silence: What Is SoundWire‑I3S and Why It Matters
- What It Will Take to Build a Resilient Automotive Compute Ecosystem
- The Blind Spot of Semiconductor IP Sales
- Scalable I/O Virtualization: A Deep Dive into PCIe’s Next Gen Virtualization
- UEC-LLR: The Future of Loss Recovery in Ethernet for AI and HPC