NeuReality Accelerates 7nm AI Chip Tape-Out with Cloud-Based Emulation
Say you’re a small company with a big idea, but are just getting started. Because your first silicon AI chip design is in development, you have a limited budget to get your offering off the ground. You also know that, given competitive pressures, the faster you get to market, the better. In this scenario, any tools or technologies that can help accelerate the AI chip design and verification process can also provide a foundation for your company’s success.
For Caesarea, Israel-based NeuReality, which develops purpose-built AI inference platforms, its helping hand came by way of cloud-based chip design emulation, specifically Synopsys ZeBu® Cloud. Rather than go through the costly, time-consuming process of building its own semiconductor emulation infrastructure, NeuReality took advantage of the flexibility, scalability, and elasticity of the cloud, and achieved tape-out and production of the world’s most complex chips on schedule. Read on to learn more about NeuReality’s quest to make AI adoption easy.
To read the full article, click here
Related Semiconductor IP
- Specialized Video Processing NPU IP for SR, NR, Demosaic, AI ISP, Object Detection, Semantic Segmentation
- Ultra-Low-Power Temperature/Voltage Monitor
- Multi-channel Ultra Ethernet TSS Transform Engine
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
Related Blogs
- Mentium Accelerates Tape-out of AI Accelerator Chip for Space Applications on Synopsys Cloud
- Could TSMC be your next chip design cloud owner?
- Leveraging a Unified Emulation and Prototyping System to Address Verification Requirements Across the Chip Development Cycle
- TetraMem Delivers RISC-V AI Accelerator Tape-Out in Record Time on Synopsys Cloud
Latest Blogs
- Silicon Insurance: Why eFPGA is Cheaper Than a Respin
- One Bit Error is Not Like Another: Understanding Failure Mechanisms in NVM
- Introducing CoreCollective for the next era of open collaboration for the Arm software ecosystem
- Integrating eFPGA for Hybrid Signal Processing Architectures
- eUSB2V2: Trends and Innovations Shaping the Future of Embedded Connectivity