What’s on the Horizon for NAND and DRAM?
January is a time where lots of planning and forecast are made, with high hopes usually. Semiconductor memory industry, after several years of prolonged downturn, finally started to see some glimpses of recovery lately. Prices are improving, product migrations happening, new process node migration providing production efficiency and hopefully more profitability to the manufacturers.
Related Semiconductor IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- Parameterizable compact BCH codec
- 1G BASE-T Ethernet Verification IP
- Network-on-Chip (NoC)
- Microsecond Channel (MSC/MSC-Plus) Controller
Related Blogs
- More signs of spring for the 2010 DRAM market
- DRAM vendors look to 40nm process technology to keep DRAM profits flowing next year
- Cadence support for the Open NAND Flash Interface (ONFI) 3.0 controller and PHY IP solution + PCIe Controller IP opening the door for NVM Express support
- AMD GPUs using new HBM DRAM (and the cost/benefit appears balanced!)
Latest Blogs
- Rivian’s autonomy breakthrough built with Arm: the compute foundation for the rise of physical AI
- AV1 Image File Format Specification Gets an Upgrade with AVIF v1.2.0
- Industry’s First End-to-End eUSB2V2 Demo for Edge AI and AI PCs at CES
- Integrating Post-Quantum Cryptography (PQC) on Arty-Z7
- UA Link PCS customizations from 800GBASE-R Ethernet PCS Clause 172