What’s on the Horizon for NAND and DRAM?
January is a time where lots of planning and forecast are made, with high hopes usually. Semiconductor memory industry, after several years of prolonged downturn, finally started to see some glimpses of recovery lately. Prices are improving, product migrations happening, new process node migration providing production efficiency and hopefully more profitability to the manufacturers.
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- 1.6T/3.2T Multi-Channel MACsec Engine with TDM Interface (MACsec-IP-364)
- 100G MAC and PCS core
- xSPI + eMMC Combo PHY IP
- NavIC LDPC Decoder
Related Blogs
- More signs of spring for the 2010 DRAM market
- DRAM vendors look to 40nm process technology to keep DRAM profits flowing next year
- Cadence support for the Open NAND Flash Interface (ONFI) 3.0 controller and PHY IP solution + PCIe Controller IP opening the door for NVM Express support
- AMD GPUs using new HBM DRAM (and the cost/benefit appears balanced!)
Latest Blogs
- Morgan State University (MSU) Leveraging Intel 16 and the Cadence Tool Flow for Academic Chip Tapeout
- Securing the Future of Terabit Ethernet: Introducing the Rambus Multi-Channel Engine MACsec-IP-364 (+363)
- Why Weebit’s IP Licensing Model Matters
- Arasan’s xSPI/eMMC5.1 PHY: Unified Dual-Mode Physical Layer IP
- Evolution of CXL PBR Switch in the CXL Fabric