DRAM vendors look to 40nm process technology to keep DRAM profits flowing next year
Taiwan Economic News reports that DRAM vendors will be bringing 4x nm process technologies on line during 2010 and 2011 to keep manufacturing profits up. According to P L Pai, vice president of Nanya Technology, DRAM chip makers are presently climbing the learning curve with 40nm process technologies and he says that the lead time of 40nm immersion tools averages nine months.
Related Semiconductor IP
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- USB 20Gbps Device Controller
- SM4 Cipher Engine
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
Related Blogs
- Blogging from Taiwan: TSMC and 40nm Yield
- TSMC 40nm Yield Explained!
- Moore’s Law and 40nm Yield
- Anticipating the (40nm) Deluge
Latest Blogs
- Shaping the Future of Semiconductor Design Through Collaboration: Synopsys Wins Multiple TSMC OIP Partner of the Year Awards
- Pushing the Boundaries of Memory: What’s New with Weebit and AI
- Root of Trust: A Security Essential for Cyber Defense
- Evolution of AMBA AXI Protocol: An Introduction to the Issue L Update
- An Introduction to AMBA CHI Chip-to-Chip (C2C) Protocol