DRAM vendors look to 40nm process technology to keep DRAM profits flowing next year
July 1, 2010
Taiwan Economic News reports that DRAM vendors will be bringing 4x nm process technologies on line during 2010 and 2011 to keep manufacturing profits up. According to P L Pai, vice president of Nanya Technology, DRAM chip makers are presently climbing the learning curve with 40nm process technologies and he says that the lead time of 40nm immersion tools averages nine months.
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related Blogs
- Blogging from Taiwan: TSMC and 40nm Yield
- TSMC explains 40nm yield problems, metal-gate stacks and why 100 per cent utilisation is bad
- TSMC 40nm Yield Explained!
- Moore’s Law and 40nm Yield
Latest Blogs
- Cadence Announces Industry's First Verification IP for Embedded USB2v2 (eUSB2v2)
- The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
- Understanding Extended Metadata in CXL 3.1: What It Means for Your Systems
- 2025 Outlook with Mahesh Tirupattur of Analog Bits
- eUSB2 Version 2 with 4.8Gbps and the Use Cases: A Comprehensive Overview