Moore's Law and Semiconductor Design and Manufacturing
The semiconductor design and manufacturing challenges at 40nm and 28nm are a direct result of Moore’s Law, the climbing transistor count and shrinking geometries. It’s a process AND design issue and the interaction is at the transistor level. Transistors may be shrinking, but atoms aren’t. So now it actually matters when even a few atoms are out of place. So process variations, whether they are statistical, proximity, or otherwise, have got to be thoughtfully accounted for, if we are to achieve low-power, high-performance, and high yield design goals.
To read the full article, click here
Related Semiconductor IP
- 6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
- LunaNet AFS LDPC Encoder and Decoder IP Core
- ReRAM NVM in DB HiTek 130nm BCD
- UFS 5.0 Host Controller IP
- PDM Receiver/PDM-to-PCM Converter
Related Blogs
- How Is the Semiconductor Industry Handling Scaling: Is Moore's Law Still Alive?
- Reshoring Semiconductor Manufacturing
- Semiconductor Growth from AI-Driven Design Productivity
- Can the Semiconductor Industry Overcome Thermal Design Challenges in Multi-Die Systems?
Latest Blogs
- Synopsys Advances Die‑to‑Die Connectivity with 64G UCIe IP Tape‑Out
- The 5 Biggest Challenges in Modern SoC Design (And How to Solve Them)
- Can Your NPU Run DOOM? Chimera Can.
- Importance Of Hardware Security Verification In Pre-Silicon Design
- Arteris × XuanTie: The “Data Highway” for High-Performance RISC-V SoCs