The realities of IP reuse
August 17, 2011
Long touted as a silver bullet, IP reuse often fails to live up to expectations when it comes to increasing semiconductor R&D productivity and throughput. That’s because most IC development teams fail to recognize a critical non-linear relationship exists between the amount of circuitry they modify or “improve” in pre-existing IP blocks and the effort the engineering team expends in making those modified blocks operate properly in the target IC. Bottom line: small changes can have a disproportionate impact on project effort. Not being fully cognizant of the specifics of this non-linear behavior is a common trap into which myriad engineering teams unwittingly fall.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related Blogs
- Tips on Using e Macros to Raise Abstraction and Facilitate Reuse
- Design Reuse: It's Harder Than it Looks
- Why your Internal IP Reuse Strategy is not Working
- How Will High-Level Synthesis Affect the Make vs. Buy vs. Re-use Decision?
Latest Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms