Intel's 22nm Process. Atom, ARM, Apple
May 8, 2011
Intel had a big press event yesterday at which they announced details of their 22nm process. In a change from their current processes, it goes with a vertical gate. In fact 3 gates which gives them much better control of leakage through transistors that are switched off, along with more transmission through the on transistors. They claim to get 37% better performance and 50% power reduction compared to 32nm. Although vertical transistors have been talked about for nearly a decade, Intel's tri-gate is the first time anyone has brought them into volume production.
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- MIPI SoundWire I3S Peripheral IP
- LPDDR6/5X/5 Controller IP
- Post-Quantum ML-KEM IP Core
- MIPI SoundWire I3S Manager IP
Related Blogs
- 22nm Finfet May Extend Intel's Two Year Lead In Process
- Samsung 28nm Beats Intel 22nm!
- Intel Losing Control Of Process Technology
- ARM 1176 in IBM SOI process demonstrates a cell-based flow
Latest Blogs
- Why Standard-Cell Architecture Matters for Adaptable ASIC Designs
- ML-KEM explained: Quantum-safe Key Exchange for secure embedded Hardware
- Rivos Collaborates to Complete Secure Provisioning of Integrated OpenTitan Root of Trust During SoC Production
- From GPUs to Memory Pools: Why AI Needs Compute Express Link (CXL)
- Verification of UALink (UAL) and Ultra Ethernet (UEC) Protocols for Scalable HPC/AI Networks using Synopsys VIP