Intel's 22nm Process. Atom, ARM, Apple
May 8, 2011
Intel had a big press event yesterday at which they announced details of their 22nm process. In a change from their current processes, it goes with a vertical gate. In fact 3 gates which gives them much better control of leakage through transistors that are switched off, along with more transmission through the on transistors. They claim to get 37% better performance and 50% power reduction compared to 32nm. Although vertical transistors have been talked about for nearly a decade, Intel's tri-gate is the first time anyone has brought them into volume production.
To read the full article, click here
Related Semiconductor IP
- Multi-channel, multi-rate Ethernet aggregator - 10G to 400G AX (e.g., AI)
- Multi-channel, multi-rate Ethernet aggregator - 10G to 800G DX
- 200G/400G/800G Ethernet PCS/FEC
- 50G/100G MAC/PCS/FEC
- 25G/10G/SGMII/ 1000BASE-X PCS and MAC
Related Blogs
- 22nm Finfet May Extend Intel's Two Year Lead In Process
- Samsung 28nm Beats Intel 22nm!
- Intel Losing Control Of Process Technology
- ARM 1176 in IBM SOI process demonstrates a cell-based flow