Intel's 22nm Process. Atom, ARM, Apple
Intel had a big press event yesterday at which they announced details of their 22nm process. In a change from their current processes, it goes with a vertical gate. In fact 3 gates which gives them much better control of leakage through transistors that are switched off, along with more transmission through the on transistors. They claim to get 37% better performance and 50% power reduction compared to 32nm. Although vertical transistors have been talked about for nearly a decade, Intel's tri-gate is the first time anyone has brought them into volume production.
To read the full article, click here
Related Semiconductor IP
- UCIe Chiplet PHY & Controller
- MIPI D-PHY1.2 CSI/DSI TX and RX
- Low-Power ISP
- eMMC/SD/SDIO Combo IP
- DP/eDP
Related Blogs
- 22nm Finfet May Extend Intel's Two Year Lead In Process
- Samsung 28nm Beats Intel 22nm!
- Intel Losing Control Of Process Technology
- Arm Delivers a Comprehensive Physical IP Platform for Optimized SoCs with TSMC 22nm ULP/ULL Process Technology
Latest Blogs
- Cycuity Partners with SiFive and BAE Systems to Strengthen Microelectronics Design Supply Chain Security
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones