Intel's 22nm Process. Atom, ARM, Apple
May 8, 2011
Intel had a big press event yesterday at which they announced details of their 22nm process. In a change from their current processes, it goes with a vertical gate. In fact 3 gates which gives them much better control of leakage through transistors that are switched off, along with more transmission through the on transistors. They claim to get 37% better performance and 50% power reduction compared to 32nm. Although vertical transistors have been talked about for nearly a decade, Intel's tri-gate is the first time anyone has brought them into volume production.
To read the full article, click here
Related Semiconductor IP
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- FH-OFDM Modem
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- PQC CRYSTALS core for accelerating NIST FIPS 202 FIPS 203 and FIPS 204
- USB Full Speed Transceiver
Related Blogs
- 22nm Finfet May Extend Intel's Two Year Lead In Process
- Samsung 28nm Beats Intel 22nm!
- Intel Losing Control Of Process Technology
- ARM 1176 in IBM SOI process demonstrates a cell-based flow