22nm Finfet May Extend Intel's Two Year Lead In Process
July 25, 2011
Intel has a two year lead in process technology over the rest of the semiconductor industry and could get further ahead if yields are satisfactory on its finfet-based 22nm process due for introduction later this year, said Mike Bryant, CTO of Future Horizons, at last week's IFS 2011.
To read the full article, click here
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related Blogs
- The HDCP 2.2 Authentication Process - an Introduction
- Intel Losing Control Of Process Technology
- Intel's 22nm Process. Atom, ARM, Apple
- Samsung 28nm Beats Intel 22nm!
Latest Blogs
- FiRa 3.0 Use Cases: Expanding the Future of UWB Technology
- Cadence Announces Industry's First Verification IP for Embedded USB2v2 (eUSB2v2)
- The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
- Understanding Extended Metadata in CXL 3.1: What It Means for Your Systems
- 2025 Outlook with Mahesh Tirupattur of Analog Bits