22nm Finfet May Extend Intel's Two Year Lead In Process
July 25, 2011
Intel has a two year lead in process technology over the rest of the semiconductor industry and could get further ahead if yields are satisfactory on its finfet-based 22nm process due for introduction later this year, said Mike Bryant, CTO of Future Horizons, at last week's IFS 2011.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related Blogs
- The HDCP 2.2 Authentication Process - an Introduction
- Intel Losing Control Of Process Technology
- Intel's 22nm Process. Atom, ARM, Apple
- Samsung 28nm Beats Intel 22nm!
Latest Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms