22nm Finfet May Extend Intel's Two Year Lead In Process
July 25, 2011
Intel has a two year lead in process technology over the rest of the semiconductor industry and could get further ahead if yields are satisfactory on its finfet-based 22nm process due for introduction later this year, said Mike Bryant, CTO of Future Horizons, at last week's IFS 2011.
To read the full article, click here
Related Semiconductor IP
- 112G Multi-SerDes
- SHA3 Cryptographic Hash Cores
- ISO/IEC 7816 Verification IP
- 50MHz to 800MHz Integer-N RC Phase-Locked Loop on SMIC 55nm LL
- Simulation VIP for AMBA CHI-C2C
Related Blogs
- The HDCP 2.2 Authentication Process - an Introduction
- Intel Losing Control Of Process Technology
- Intel's 22nm Process. Atom, ARM, Apple
- Samsung 28nm Beats Intel 22nm!
Latest Blogs
- Automotive Ethernet with Comcores – Safety, Quality and ASIL certification of IP
- A Comparison on Different AMBA 5 CHI Verification IPs
- Cadence Recognized as TSMC OIP Partner of the Year at 2025 OIP Ecosystem Forum
- Accelerating Development Cycles and Scalable, High-Performance On-Device AI with New Arm Lumex CSS Platform
- Desktop-Quality Ray-Traced Gaming and Intelligent AI Performance on Mobile with New Arm Mali G1-Ultra GPU