IEDM: The Big Decisions for 5nm
The Sunday of IEDM there were two all-day short courses. The one I attended was Technology Options for the 5nm Node. It was organized by An Steegen of imec. I am not going to attempt to cover the entire day's presentations in a short post like this, but the topics covered included lithography, channel materials, transistor options beyond FinFET, low-resistance contacts, minimizing parasitics in the metal stack, and metrology.
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
- ML-DSA Digital Signature Engine
- P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
Related Blogs
- 2024 Set The Stage For NoC Interconnect Innovations In SoC Design
- Semidynamics – Customizable RISC-V Technology for the Next Five AI Revolutions
- Real-Time Intelligence for Physical AI at the Edge
- Introducing the MIPS Atlas Portfolio for Physical AI
Latest Blogs
- Why What Where DIFI and the new version 1.3
- ML-DSA explained: Quantum-Safe digital Signatures for secure embedded Systems
- Efficiency Defines The Future Of Data Movement
- Why Standard-Cell Architecture Matters for Adaptable ASIC Designs
- ML-KEM explained: Quantum-safe Key Exchange for secure embedded Hardware