IEDM 2017 - Intel Versus GLOBALFOUNDRIES at the Leading Edge
As I have discussed in previous blogs, IEDM is one of the premier conferences to learn about the latest developments in semiconductor technology.
On Wednesday December 6th, the Circuit and Device Interaction - Advanced Platform Technologies session was held, and Intel presented their 10nm technology and GLOBALFOUNDRIES (GF) presented their 7nm technology. Despite the different node names, the two processes have similar density. In this article I will combine previous disclosures, interviews and the papers to present a detailed comparison of these two leading edge technologies.
To read the full article, click here
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related Blogs
- UMC versus GLOBALFOUNDRIES
- Redefining the Foundry Model: TSMC versus GlobalFoundries
- TSMC versus GlobalFoundries: Semiconductor Design Enablement!
- GlobalFoundries Versus Samsung!
Latest Blogs
- Cadence Announces Industry's First Verification IP for Embedded USB2v2 (eUSB2v2)
- The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
- Understanding Extended Metadata in CXL 3.1: What It Means for Your Systems
- 2025 Outlook with Mahesh Tirupattur of Analog Bits
- eUSB2 Version 2 with 4.8Gbps and the Use Cases: A Comprehensive Overview