TSMC versus GlobalFoundries: Semiconductor Design Enablement!
As mentioned in previous blogs, design enablement is a key enabler to fabless semiconductor design and manufacture, without question. The purpose of this blog (in 500 words) is to compare and contrast two very different design enablement strategies and engage the semiconductor community in a meaningful discussion.
The GlobalFoundry strategy is straight forward so let’s start there. GFI is partnering with leading design enablement companies to advance semiconductor design at the 28nm node. GFI is committed to becoming the FIRST SOURCE for 28nm, competing directly with TSMC, while other foundries have in the past offered “T” like processes for 2nd and 3rd source manufacturing strategies (UMC, Chartered Semi, SMIC).
Related Semiconductor IP
- CAN XL Verification IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- Neuromorphic Processor IP
Related Blogs
- TSMC vs GlobalFoundries vs IBM
- TSMC vs GlobalFoundries IBM Samsung
- How to Obtain ASIC Full Turnkey Services from TSMC and GLOBALFOUNDRIES?
- TSMC (Lincoln) vs Samsung (Clinton) vs Intel (Washington)
Latest Blogs
- Analog Design and Layout Migration automation in the AI era
- UWB, Digital Keys, and the Quest for Greater Range
- Building Smarter, Faster: How Arm Compute Subsystems Accelerate the Future of Chip Design
- MIPS P8700 RISC-V Processor for Advanced Functional Safety Systems
- Boost SoC Flexibility: 4 Design Tips for Memory Subsystems with Combo DDR3/4 Interfaces