TSMC versus GlobalFoundries: Semiconductor Design Enablement!
August 9, 2010
As mentioned in previous blogs, design enablement is a key enabler to fabless semiconductor design and manufacture, without question. The purpose of this blog (in 500 words) is to compare and contrast two very different design enablement strategies and engage the semiconductor community in a meaningful discussion.
The GlobalFoundry strategy is straight forward so let’s start there. GFI is partnering with leading design enablement companies to advance semiconductor design at the 28nm node. GFI is committed to becoming the FIRST SOURCE for 28nm, competing directly with TSMC, while other foundries have in the past offered “T” like processes for 2nd and 3rd source manufacturing strategies (UMC, Chartered Semi, SMIC).
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Bluetooth Low Energy 6.0 Digital IP
- Verification IP for Ultra Ethernet (UEC)
- MIPI SWI3S Manager Core IP
- Ultra-low power high dynamic range image sensor
Related Blogs
- TSMC vs GlobalFoundries vs IBM
- TSMC vs GlobalFoundries IBM Samsung
- How to Obtain ASIC Full Turnkey Services from TSMC and GLOBALFOUNDRIES?
- TSMC (Lincoln) vs Samsung (Clinton) vs Intel (Washington)
Latest Blogs
- How is RISC-V’s open and customizable design changing embedded systems?
- Imagination GPUs now support Vulkan 1.4 and Android 16
- From "What-If" to "What-Is": Cadence IP Validation for Silicon Platform Success
- Accelerating RTL Design with Agentic AI: A Multi-Agent LLM-Driven Approach
- UEC-CBFC: Credit-Based Flow Control for Next-Gen Ethernet in AI and HPC