Flip Chip: An established platform still in mutation!
Flip-Chip is a chip packaging technique in which the active area of the chip is ‘flipped over’ facing downward, instead of facing up and bonded to the package leads with wires from the outside edges of the chip.
Any surface area of the Flip-Chip can be used for interconnection, which is typically done through metal bumps. These bumps are soldered onto the package and underfilled with epoxy. The Flip-Chip allows for a large number of interconnects with shorter distances than wire, which greatly reduces inductance.
According to Lionel Cadix, market and technology analyst, Yole Developpement, France, metal bumps can be made of solder (tin, tin-lead or lead-free alloys), copper, gold and copper-tin or Au-tin alloys. The package substrates are epoxy-based (organic substrates), ceramic based, copper based (leadframe substrates), and silicon or glass based.
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- MIPI SoundWire I3S Peripheral IP
- LPDDR6/5X/5 Controller IP
- Post-Quantum ML-KEM IP Core
- MIPI SoundWire I3S Manager IP
Related Blogs
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms
- Bringing MEMS and asynchronous logic into an SoC design flow
- Intel's First 14nm Chip NOT an x86 Processor
- Can FPGA Fabric and an SoC Co-Exist on the Same Chip?
Latest Blogs
- ML-KEM explained: Quantum-safe Key Exchange for secure embedded Hardware
- Rivos Collaborates to Complete Secure Provisioning of Integrated OpenTitan Root of Trust During SoC Production
- From GPUs to Memory Pools: Why AI Needs Compute Express Link (CXL)
- Verification of UALink (UAL) and Ultra Ethernet (UEC) Protocols for Scalable HPC/AI Networks using Synopsys VIP
- Enhancing PCIe6.0 Performance: Flit Sequence Numbers and Selective NAK Explained