EUV Will Not be Ready For 14nm, says Imec President...
December 28, 2012
EUV will not be ready for 14nm,says the President of Imec, Luc van den Hove.
"I believe the time to decide lithography options for 14nm is basically now, and it's clear EUV is not ready for the challenge," said van den Hove.
One option at 14nm is triple patterning, but this would increase wafer cost by 90% compared to 28nm, said van den Hove.
To read the full article, click here
Related Semiconductor IP
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
- HiFi iQ DSP
- CXL 4 Verification IP
- JESD204E Controller IP
Related Blogs
- Six Issues that will Inhibit Profitable Growth in 2010 - Be Ready
- Why IC Prices Will Be High In 2011
- Smartphone ICs Are Not A Comfortable Place To be
- Global semiconductor market will be $313 billion in 2012: SSIA
Latest Blogs
- The Memory Imperative for Next-Generation AI Accelerator SoCs
- Leadership in CAN XL strengthens Bosch’s position in vehicle communication
- Validating UPLI Protocol Across Topologies with Cadence UALink VIP
- Cadence Tapes Out 32GT/s UCIe IP Subsystem on Samsung 4nm Technology
- LPDDR6 vs. LPDDR5 and LPDDR5X: What’s the Difference?