EUV Will Not be Ready For 14nm, says Imec President...
EUV will not be ready for 14nm,says the President of Imec, Luc van den Hove.
"I believe the time to decide lithography options for 14nm is basically now, and it's clear EUV is not ready for the challenge," said van den Hove.
One option at 14nm is triple patterning, but this would increase wafer cost by 90% compared to 28nm, said van den Hove.
To read the full article, click here
Related Semiconductor IP
- eDP 2.0 Verification IP
- Gen#2 of 64-bit RISC-V core with out-of-order pipeline based complex
- LLM AI IP Core
- Post-Quantum Digital Signature IP Core
- Compact Embedded RISC-V Processor
Related Blogs
- Six Issues that will Inhibit Profitable Growth in 2010 - Be Ready
- Why IC Prices Will Be High In 2011
- Smartphone ICs Are Not A Comfortable Place To be
- Global semiconductor market will be $313 billion in 2012: SSIA
Latest Blogs
- From GPUs to Memory Pools: Why AI Needs Compute Express Link (CXL)
- Verification of UALink (UAL) and Ultra Ethernet (UEC) Protocols for Scalable HPC/AI Networks using Synopsys VIP
- Enhancing PCIe6.0 Performance: Flit Sequence Numbers and Selective NAK Explained
- Smarter ASICs and SoCs: Unlocking Real-World Connectivity with eFPGA and Data Converters
- RISC-V Takes First Step Toward International Standardization as ISO/IEC JTC1 Grants PAS Submitter Status