EUV Will Not be Ready For 14nm, says Imec President...
EUV will not be ready for 14nm,says the President of Imec, Luc van den Hove.
"I believe the time to decide lithography options for 14nm is basically now, and it's clear EUV is not ready for the challenge," said van den Hove.
One option at 14nm is triple patterning, but this would increase wafer cost by 90% compared to 28nm, said van den Hove.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related Blogs
- Six Issues that will Inhibit Profitable Growth in 2010 - Be Ready
- Need really big FPGAs? Xilinx will be taking the "3D" route for initial Virtex 7 parts
- Why IC Prices Will Be High In 2011
- Smartphone ICs Are Not A Comfortable Place To be
Latest Blogs
- lowRISC Tackles Post-Quantum Cryptography Challenges through Research Collaborations
- How to Solve the Size, Weight, Power and Cooling Challenge in Radar & Radio Frequency Modulation Classification
- Programmable Hardware Delivers 10,000X Improvement in Verification Speed over Software for Forward Error Correction
- The Integrated Design Challenge: Developing Chip, Software, and System in Unison
- Introducing Mi-V RV32 v4.0 Soft Processor: Enhanced RISC-V Power