Embracing Multi-Die Systems and Photonics for Aerospace and Government Applications
If you were to open an aircraft from 30 years ago, the stark contrast in technological capabilities when compared to a modern aircraft would be readily apparent to even those unfamiliar with the aerospace industry. Traditional aircraft once relied on copper wires for transmitting electrical signals and data. However, with the emergence of new chip architectures and the growing benefits of fiber optics, as well as the replacement of metals such as aluminum with carbon fiber, the way that today’s government, aerospace, and defense systems are designed has changed dramatically.
In particular, two technologies are taking the industry by storm with their impressive growth and development trajectory: 3D heterogeneous integration and photonics.
Before we delve into how these technologies are driving innovation and enabling more advanced and efficient solutions from ground to space, let’s start by establishing some important definitions.
To read the full article, click here
Related Semiconductor IP
- UFS 5.0 Host Controller IP
- PDM Receiver/PDM-to-PCM Converter
- Voltage and Temperature Sensor with integrated ADC - GlobalFoundries® 22FDX®
- 8MHz / 40MHz Pierce Oscillator - X-FAB XT018-0.18µm
- UCIe RX Interface
Related Blogs
- Why Choose Hard IP for Embedded FPGA in Aerospace and Defense Applications
- LPDDR6: A New Standard and Memory Choice for AI Data Center Applications
- Embedded Security explained: IPsec and IKEv2 for embedded Systems
- How Photonics Can Light the Way for Higher Performing Multi-Die Systems
Latest Blogs
- Satellite communications are no longer as secure as assumed
- Why Hardware Monitoring Needs Infrastructure, Not Just Sensors
- Why Post-Quantum Cryptography Doesn’t Replace Classical Cryptography
- The Silent Guardian of AI Compute - PUFrt Unifies Hardware Security and Memory Repair to Build the Trust Foundation for AI Factories
- Heterogeneous NPU Data Movement Tax: Intel's Own Slides Tell the Story