Embracing Multi-Die Systems and Photonics for Aerospace and Government Applications
If you were to open an aircraft from 30 years ago, the stark contrast in technological capabilities when compared to a modern aircraft would be readily apparent to even those unfamiliar with the aerospace industry. Traditional aircraft once relied on copper wires for transmitting electrical signals and data. However, with the emergence of new chip architectures and the growing benefits of fiber optics, as well as the replacement of metals such as aluminum with carbon fiber, the way that today’s government, aerospace, and defense systems are designed has changed dramatically.
In particular, two technologies are taking the industry by storm with their impressive growth and development trajectory: 3D heterogeneous integration and photonics.
Before we delve into how these technologies are driving innovation and enabling more advanced and efficient solutions from ground to space, let’s start by establishing some important definitions.
To read the full article, click here
Related Semiconductor IP
- xSPI Multiple Bus Memory Controller
- MIPI CSI-2 IP
- PCIe Gen 7 Verification IP
- WIFI 2.4G/5G Low Power Wakeup Radio IP
- Radar IP
Related Blogs
- SLM Solutions for Mission-Critical Aerospace and Government Chip Designs
- Why Choose Hard IP for Embedded FPGA in Aerospace and Defense Applications
- Ensuring the Health and Reliability of Multi-Die Systems
- How Photonics Can Light the Way for Higher Performing Multi-Die Systems
Latest Blogs
- The Growing Importance of PVT Monitoring for Silicon Lifecycle Management
- Unlock early software development for custom RISC-V designs with faster simulation
- HBM4 Boosts Memory Performance for AI Training
- Using AI to Accelerate Chip Design: Dynamic, Adaptive Flows
- Locking When Emulating Xtensa LX Multi-Core on a Xilinx FPGA