Cadence Commits to Join imec Automotive Chiplet Programme
The automotive industry stands on the cusp of a technological renaissance, ushering in an era where vehicles aren't just tools of transportation but interconnected nodes within a vast network of software-defined mobility. Central to this transformation are chiplets—miniaturized, modular components that can be mixed, matched, and scaled to create powerful, application-specific integrated circuits (ASICs). This blog post delves into the significance of chiplets for the automotive industry, the objectives of the imec automotive chiplet programme, and Cadence's pivotal role in this groundbreaking initiative.
Why Chiplets Are Important for the Automotive Industry
The automotive industry is experiencing rapid advancements in electrification, autonomy, and the shift from hardware to software-defined vehicles. These key transformations necessitate innovation in electronics to meet the increasing demands for data movement, processing, storage, and security. Chiplets present an attractive solution by offering a scalable architecture that can address these challenges efficiently. Here are some key reasons why chiplets are crucial for the automotive industry:
Here are some key reasons why chiplets are crucial for the automotive industry:
- Scalability and Flexibility: Chiplets enable a modular design approach, allowing for scalable performance from Level 2 ADAS up to Level 5 full autonomy.
- Cost and Development Time: Reusing known-good chiplet designs from previous generations reduces R&D costs and accelerates time to market.
- Enhanced Functionality: The fusion of data from multi-spectral cameras, radar, and lidar through specialized sensor chiplets enables "vision" beyond human capability, which is critical for safe autonomous driving.
- High Performance: Compute chiplets can provide data center-level processing and networking power, essential for the next generation of automotive applications.
What Is the imec Automotive Chiplet Programme?
To read the full article, click here
Related Semiconductor IP
- Network-on-Chip (NoC)
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- UCIe PHY (Die-to-Die) IP
- UCIe-S 64GT/s PHY IP
- UA Link DL IP core
Related Blogs
- Jumpstarting the Automotive Chiplet Ecosystem
- Cadence Transforms Chiplet Technology with First Arm-Based System Chiplet
- Dream Chip, Cadence Unveil Automotive SoC with Tensilica IP at embedded world '25
- Cadence Silicon Success of UCIe IP on Samsung Foundry’s 5nm Automotive Process
Latest Blogs
- Design specification: The cornerstone of an ASIC collaboration
- The importance of ADCs in low-power electrocardiography ASICs
- VESA Adaptive-Sync V2 Operation in DisplayPort VIP
- Design, Verification, and Software Development Decisions Require a Single Source of Truth
- CAVP-Validated Post-Quantum Cryptography