ARM POPs Another One!
ARM announced a new POP deal with UMC 28nm last week. POP stands for Processor Optimized Package meaning physical IP libraries (logic and memory) are customized for ARM processor cores and mainstream EDA tools creating a platform for optimized chip design. POP is a much bigger deal than most people realize so let’s get into a little more detail.
Having spent a significant amount of my 30+ year career in Semiconductor IP I may have a different view than most people. While EDA got the fabless semiconductor ecosystem and my illustrious career started, it was commercial semiconductor IP that got us to where we are today, absolutely.
To read the full article, click here
Related Semiconductor IP
- ARM HSSTP PHY with Link Layer
- AHB Low Power Subsystem - ARM Cortex M0
- AHB Performance Subsystem - ARM Cortex M0
- AHB Performance Subsystem - ARM Cortex M3
- AHB Secure Subsystem - ARM Cortex M3
Related Blogs
- Synopsys acquires Magma! And, another one bites the dust!!
- Semiconductor IP Sector Overview
- EDA Industry: Consolidation Remains a Priority
- ST-Ericsson: A New Force in Wireless Semiconductors (Part 1)
Latest Blogs
- CNNs and Transformers: Decoding the Titans of AI
- How is RISC-V’s open and customizable design changing embedded systems?
- Imagination GPUs now support Vulkan 1.4 and Android 16
- From "What-If" to "What-Is": Cadence IP Validation for Silicon Platform Success
- Accelerating RTL Design with Agentic AI: A Multi-Agent LLM-Driven Approach