Altera and Micron help propel HMC, but will 3D packaging limit interest?
Altera Corp and Micron Technology Inc demonstrated a big step forward for Hybrid Memory Cube, by showing a Stratix V interface to the promising 3D technology. How might packaging limit HMC's popularity compared to special-purpose nonvolatiles like ferroelectric or magnetoresistive RAM?
In early August, we talked about the growing importance of memory and system-bus interfaces on next-generation FPGAs. Altera and Micron, both members of the HMC Consortium, are hoping to accelerate the viability and hence the utility of hybrid cubes by making them a mainstream alternative to DRAM and SRAM. Altera not only showed a Stratix V prototype, but indicated it would work on HMC for its upcoming Gen 10 family of FPGAs.
To read the full article, click here
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- 1.8V/3.3V GPIO With I2C Compliant ODIO in GF 55nm
- Verification IP for UALink
Related Blogs
- PLD Overview: Xilinx and Altera
- Xilinx ARMs FPGAs, Altera to MIPSify Them
- Is Altera Looking At Programmable DSP?
- Semiconductor Design in 3D!