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Altera and Micron help propel HMC, but will 3D packaging limit interest?

Altera and Micron help propel HMC, but will 3D packaging limit interest?

By _FPGA Gurus
September 11, 2013

Altera Corp and Micron Technology Inc demonstrated a big step forward for Hybrid Memory Cube, by showing a Stratix V interface to the promising 3D technology. How might packaging limit HMC's popularity compared to special-purpose nonvolatiles like ferroelectric or magnetoresistive RAM?

In early August, we talked about the growing importance of memory and system-bus interfaces on next-generation FPGAs. Altera and Micron, both members of the HMC Consortium, are hoping to accelerate the viability and hence the utility of hybrid cubes by making them a mainstream alternative to DRAM and SRAM. Altera not only showed a Stratix V prototype, but indicated it would work on HMC for its upcoming Gen 10 family of FPGAs.

To read the full article, click here

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