Altera and Micron help propel HMC, but will 3D packaging limit interest?
Altera Corp and Micron Technology Inc demonstrated a big step forward for Hybrid Memory Cube, by showing a Stratix V interface to the promising 3D technology. How might packaging limit HMC's popularity compared to special-purpose nonvolatiles like ferroelectric or magnetoresistive RAM?
In early August, we talked about the growing importance of memory and system-bus interfaces on next-generation FPGAs. Altera and Micron, both members of the HMC Consortium, are hoping to accelerate the viability and hence the utility of hybrid cubes by making them a mainstream alternative to DRAM and SRAM. Altera not only showed a Stratix V prototype, but indicated it would work on HMC for its upcoming Gen 10 family of FPGAs.
To read the full article, click here
Related Semiconductor IP
- NPU IP Core for Mobile
- NPU IP Core for Edge
- Specialized Video Processing NPU IP
- HYPERBUS™ Memory Controller
- AV1 Video Encoder IP
Related Blogs
- PLD Overview: Xilinx and Altera
- Xilinx ARMs FPGAs, Altera to MIPSify Them
- Is Altera Looking At Programmable DSP?
- Semiconductor Design in 3D!
Latest Blogs
- Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
- The Role of GPU in AI: Tech Impact & Imagination Technologies
- Time-of-Flight Decoding with Tensilica Vision DSPs - AI's Role in ToF Decoding
- Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles
- Deep Robotics and Arm Power the Future of Autonomous Mobility