Ucie phy IP

Lightweight die-to-die interconnect solution consisting of the Physical Layer, Die-to-Die Layer and Protocol Layer optimized for highest performance with the lowest power and area overhead that is compliant to the Universal Chiplet Interconnect Express (UCIe) 2.0 specification.

Compliant with the UCIe specification (2.0 & 1.1)
Flexible Structure, easy to customize (Pre-hardened PHY tuned to Customer Spec, PHY + Adapter Layer, PHY + Adapter Layer + Customized Protocol Layer)
Supports the CXS/AXI using the streaming package (AXI Interface bandwidth up to 89%)

IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face advanced package.
This GUCIe PHY not only supports UCIe specification rev 1.1 compliance physical layer and Raw D2D interface (RDI) but also optionally provides the

UCIe Controller baseline for Streaming Protocols for ASIL B Compliant, AEC-Q100 Grade 2
Low latency controller for UCIe-based multi-die designs
Includes Die-to-Die Adapter layer and Protocol layer

Avery UCIe VIP provides a comprehensive verification solution featuring an advanced UVM environment that incorporates constrained random traffic gener ation, robust D2D and LogPHY layer controls and error injection, protocol checks and coverage, functional coverage, protocol analyzer-like features for debug ging, and performance analysis metrics.
PCIe/CXL VIP supports FDI/RDI adapters for complete stack verification. With the advanced capabilities of Avery VIP, engineers can work more efficiently, develop more complex tests, and work on more complex topologies, such as bifurcation.

UCIe PHY IP