UCIe Chiplet PHY & Controller

Overview

The UCIe Chiplet IP offers a cutting-edge solution for seamless, low-latency data transfer between dies and chips, enabling heterogeneous integration for performance and efficiency gains. It supports die-to-die (D2D), chip-to-chip (C2C), interposer and PCB connectivity, ideal for data centers, 5G, HPC, and AI. The IP family includes UCIe-S (24Gbps/pin, 100um~150um pitch) for MCM/short PCB, and UCIe-A (32Gbps/pin, 25um~55um pitch) for silicon interposers. Both support scalable bandwidth (UCIe-A: 2048Gbps; UCIe-S: 384Gbps) with scalability for 1/2/4/8 modules and are compatible with UCIe standard and advanced package version.

Key Features

  • Compliant with the UCIe specification (2.0 & 1.1)
  • Flexible Structure, easy to customize (Pre-hardened PHY tuned to Customer Spec, PHY + Adapter Layer, PHY + Adapter Layer + Customized Protocol Layer)
  • Supports the CXS/AXI using the streaming package (AXI Interface bandwidth up to 89%)
  • Supports the CXL/PCIE interface
  • Fault Tolerance: Supports the CRC + Retry + FEC
  • Supports FEC Mechanism (Optional)
  • Low Power: Tunable Driver/Receiver Strength & auto clock gate (Clock Gate Ratio > 95%)
  • Complete DFX mechanism for Debug
  • Supports the Performance Monitor (bandwidth/latency monitor and event monitor)
  • Supports the Complete BIST & On Die Scope mechanism (Covers protocol layer to the link layer)
  • Supports the MCM, INFO, and Interposer package plus PCB
  • High Performance: up to 24Gbps on MCM, 20Gbps on PCB, 32Gbps on interposer
  • Auto Tracking: Forward Clock, Support PVT auto tracking
  • Low Latency: Link layer latency to under 3ns
  • Full training for the PHY Layer
  • High Density: Standard Pitch and Micro Bump

Benefits

  • Fully pre-assembled design, Drop-in hard macro to ease integration and speed time to market
  • Zero risk with robust ESD architecture
  • Extensive EDA tool support for various design and automation flow
  • Optional CKE retention mode permits VDD and all non-essential I/Os to be powered down while retaining the external SDRAMs in self-refresh mode
  • Comprehensive observation registers DFX and methods are available to facilitate customers in identifying issues during testing

Block Diagram

UCIe Chiplet PHY & Controller Block Diagram

Deliverables

  • Extensive documentation
  • Models
  • LIB
  • LEF
  • Place-and-route abstracts
  • LVS netlist
  • GDSII files

Technical Specifications

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Semiconductor IP