Interface IP Cores for TSMC

Compare 73 Interface IP Cores for TSMC from 4 vendors (1 - 10)

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PCIe 6.0 PHY, TSMC N3A x4 1.2V, North/South (vertical) poly orientation for Automotive, ASIL B Random, AEC-Q100 Grade 2
- Supports the latest features of PCIe 6.x and CXL 3.x specifications
- Supports PAM-4 signaling and up to x16 lane configurations with bifurcation
- Delivers more power efficiency across channels with unique DSP algorithms
- Enables near zero link downtime with patent-pending diagnostic features
USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- Supports 40 Gbps, 20 Gbps, 10 Gbps, and 5 Gbps data rates
- Supports 480 Mbps, 12 Mbps, and 1.5 Mbps data rates
- x1 and x2 configurations (USB 3.2 and USB 3.1 PHY only)
- Low active and standby power
- Small area for low silicon cost
USB4 PHY - TSMC N3E 1.2V, North/South Poly Orientation
- Supports 40 Gbps, 20 Gbps, 10 Gbps, and 5 Gbps data rates
- Supports 480 Mbps, 12 Mbps, and 1.5 Mbps data rates
- x1 and x2 configurations (USB 3.2 and USB 3.1 PHY only)
- Low active and standby power
- Small area for low silicon cost
USB4 PHY - TSMC N5 1.2V, North/South Poly Orientation
- Supports 40 Gbps, 20 Gbps, 10 Gbps, and 5 Gbps data rates
- Supports 480 Mbps, 12 Mbps, and 1.5 Mbps data rates
- x1 and x2 configurations (USB 3.2 and USB 3.1 PHY only)
- Low active and standby power
USB4 PHY - TSMC N3P 1.2V, North/South Poly Orientation
- Supports 40 Gbps, 20 Gbps, 10 Gbps, and 5 Gbps data rates
- Supports 480 Mbps, 12 Mbps, and 1.5 Mbps data rates
- x1 and x2 configurations (USB 3.2 and USB 3.1 PHY only)
- Low active and standby power
- Small area for low silicon cost
224G-LR SerDes PHY enables 1.6T and 800G networks
- Optimized Performance, Power and Area with Design Agility
- Supports full-duplex 1.25 to 225Gbps data rates
- Enables 1.6T, 800G, 400G, and 200G Ethernet with a PHY + Controller solution
- Supports evolving IEEE 802.3 and OIF-CEI-224G standard electrical specifications
- Meets the performance requirements of chip-to-module (VSR), chip-to-chip (MR), and copper/backplane (LR) interconnects
USB 2.0 femtoPHY - TSMC N3P 1.2V x1, North/South (vertical) poly orientation
- Ported to over 50 different processes and configurations ranging from 65-nm to 14/16-nm FinFET
- Supports the USB 2.0 protocol and data rate (480 Mbps)
- Supports the USB Type-C specification
- USB femtoPHY, USB nanoPHY and USB picoPHY offer a tunability feature that allows quick, post-silicon adjustments that occur due to process variations, or unexpected chip and board parasitic, without modifying the existing design
eUSB 2.0 PHY - TSMC N3P x1, North/South (vertical) poly orientation
- Designed for 7nm processes and below
- Supports the USB 2.0 protocol and High Speed, Full Speed, and Low Speed data rates
- eUSB2 PHYs supports USB 2.0, 3.0, 3.1 and 3.2 Device, Host and Dual Role configurations
eUSB 2.0 PHY - TSMC N3E x1, North/South (vertical) poly orientation
- Designed for 7nm processes and below
- Supports the USB 2.0 protocol and High Speed, Full Speed, and Low Speed data rates
- eUSB2 PHYs supports USB 2.0, 3.0, 3.1 and 3.2 Device, Host and Dual Role configurations
USB-C 3.2 DP/TX PHY for TSMC N3P, North/South poly orientation
- USB-IF certified Synopsys USB 3.2 solution
- VESA certified Synopsys DisplayPort 1.4 Tx solution
- Industry’s only USB Type-C IP solution consisting of USB-C 3.2/DisplayPort 1.4 TX PHYs, USB-C 3.2/DisplayPort 1.4 TX controllers with HDCP 2.2 and HDCP 2.2 content protection, verification IP, and IP subsystems
- Solution supports USB Type-C, SuperSpeed USB 3.2 at 20 Gbps, SuperSpeed USB 3.1 at 10 Gbps, SuperSpeed USB 3.0 at 5 Gbps and High-Speed USB (USB 2.0) as well as DisplayPort 1.4 TX supporting RBR, HBR1, HBR2 and HBR3 bitrates