180TSMC_LVDS_10 is a library including:
• Transmitter LVDS driver (TX_LVDS);
• Receiver LVDS driver (RX_LVDS);
• Transceiver LVDS driver (RX_TX_LVDS);
• Reference current/voltage generators (RS_TOP).
RX_TX_LVDS driver has five available operation modes: transmitter, receiver, transmitter half-duplex, receiver half-duplex and shutdown.
The RS_TOP block is intended to output reference currents and voltage for RX_LVDS driver, TX_LVDS driver or TX_RX_LVDS driver.
Composing of LVDS library components allows to design a device with up to 16 pairs of data channels and 2 pairs of synchronization channels.
500Mbps LVDS IP library
Overview
Key Features
- TSMC CMOS 180 nm
- TIA/EIA-644 LVDS standards without hysteresis
- Data transfer rate: up to 500Mbps (DDR MODE)
- 3.3V IO voltage supply
- 1.8V core voltage supply
- 1.8V CMOS input/output logic control signals
- Embedded 1.8V/3.3V level shifters
Applications
- Point-to-point data transmission
- Multidrop buses
- Clock distribution
- Backplane receiver
- Backplane data transmission
- Cable data transmission
Deliverables
- Schematic or NetList
- Abstract model (.lef and .lib files)
- Layout view (optional)
- Behavioral model (Verilog)
- Extracted view (optional)
- GDSII
- DRC, LVS, antenna report
- Test bench with saved configurations (optional)
- Documentation
Technical Specifications
Foundry, Node
TSMC CMOS 180 nm
Maturity
Silicon proven
Availability
Now
TSMC
Silicon Proven:
180nm
Related IPs
- 28nm Wirebond IO library with dynamically switchable 1.8V/ 3.3V GPIO, 5V I2C open-drain, 1.8V & 3.3V analog, OTP program cell, and HDMI & LVDS protection macros - featured across a variety of metal stack and pad configuration options
- A 130nm Wirebond IO library with 3.3V GPIO, LVDS TX & RX, 3.3V I2C open-drain, analog cell and OTP program cell
- A 65nm Wirebond IO library with 2.5V GPIO, LVDS TX & RX and 2.5V analog / RF
- 200 Mbps LVDS IP library
- Library of LVDS Ios cells in SMIC 130nm~28nm
- Library of LVDS Ios cells in HHGrace 130nm~55nm