The Challenges of USB 3.0
Terrill Moore, MCCI Corporation
EDN (October 1, 2012)
After a three-year teething period, USB 3.0 is finally mainstream. Microsoft and Apple support USB 3.0 in their latest releases of Windows and Mac OS X, respectively; Intel and AMD support USB 3.0 in their latest chipsets. This creates critical mass, which will cause USB 3.0 peripheral deployment to ramp significantly in the coming year. This will fuel a new round of USB 3.0 adoption in embedded systems. This article explores the likely issues that developers will encounter when bringing up USB 3.0 devices.
To read the full article, click here
Related Semiconductor IP
- Super Speed USB 3.0 Extensible Host Controller xHCI
- USB 3.0 xHCI Driver software
- USB 3.0 SSIC Adapter
- USB 3.0 Device Upgrade IP Core
- USB 3.0 Device
Related Articles
- SuperSpeed USB 3.0: Ubiquitous Interconnect for Next Generation Consumer Applications
- Overcome signal attenuation, noise and jitter interference challenges in USB 3.0 system design
- Overcoming Wireless USB commercialization challenges
- Optimization of current-limiting solutions for USB 3.0
Latest Articles
- GenAI for Systems: Recurring Challenges and Design Principles from Software to Silicon
- Creating a Frequency Plan for a System using a PLL
- RISCover: Automatic Discovery of User-exploitable Architectural Security Vulnerabilities in Closed-Source RISC-V CPUs
- MING: An Automated CNN-to-Edge MLIR HLS framework
- Fault Tolerant Design of IGZO-based Binary Search ADCs