Reliability challenges in 3D IC semiconductor design
By John Ferguson - Director of Product Management, Siemens DIS
EETimes (November 28, 2023)
3D ICs represent an expansion of heterogeneous advanced package technology into the third dimension, presenting similar design to manufacturability challenges as 2D advanced packages along with additional complexities. While not yet widespread, the advent of chiplet standardization initiatives and the development of supporting tools are making 3D ICs more feasible and profitable for a broader range of players, including both large and small companies with smaller production runs.
The implementation of 3D ICs allows companies to divide a design into functional subcomponents and integrate the resulting IP at the most suitable process nodes. This facilitates low latency, high bandwidth data movement, reduced manufacturing costs, increased wafer yields, lower power consumption, and overall decreased expenses. These appealing advantages are driving significant growth and progress in advanced heterogeneous packaging and 3D IC technologies.
To read the full article, click here
Related Semiconductor IP
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- USB 20Gbps Device Controller
- SM4 Cipher Engine
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
Related White Papers
- Emerging Trends and Challenges in Embedded System Design
- Integrating VESA DSC and MIPI DSI in a System-on-Chip (SoC): Addressing Design Challenges and Leveraging Arasan IP Portfolio
- It's Just a Jump to the Left, Right? Shift Left in IC Design Enablement
- Bigger Chips, More IPs, and Mounting Challenges in Addressing the Growing Complexity of SoC Design
Latest White Papers
- Fault Injection in On-Chip Interconnects: A Comparative Study of Wishbone, AXI-Lite, and AXI
- eFPGA – Hidden Engine of Tomorrow’s High-Frequency Trading Systems
- aTENNuate: Optimized Real-time Speech Enhancement with Deep SSMs on RawAudio
- Combating the Memory Walls: Optimization Pathways for Long-Context Agentic LLM Inference
- Hardware Acceleration of Kolmogorov-Arnold Network (KAN) in Large-Scale Systems