Improving performance and security in IoT wearables
By Pritesh Mandaliya, Cypress Semiconductor
Many IoT applications – including connected cars, factory automation, smart city, connected health, and wearables – require nonvolatile memory to store data and code. Traditionally, embedded applications have used external Flash memory for this purpose.
However, as modern semiconductor technology faces challenges in scaling and cost as it moves to smaller geometries, it has become increasingly difficult to embed Flash memory within the host SoC. Therefore, future MCU or SoC designs are targeting system-in-package (SiP) or the use of external Flash. This trend does not address the needs of IoT applications like wearables because of their small form factor, strict cost constraints, and low-power related requirements.
To address these issues, Flash memory manufacturers are developing architectures that optimize size and power consumption. At the same time, they are introducing important new capabilities that support greater endurance, reliability, security, and safety.
To read the full article, click here
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related White Papers
- Basics of SRAM PUF and how to deploy it for IoT security
- How to achieve better IoT security in Wi-Fi modules
- IoT Security: Exploring Risks and Countermeasures Across Industries
- The Growing Imperative Of Hardware Security Assurance In IP And SoC Design
Latest White Papers
- Reimagining AI Infrastructure: The Power of Converged Back-end Networks
- 40G UCIe IP Advantages for AI Applications
- Recent progress in spin-orbit torque magnetic random-access memory
- What is JESD204C? A quick glance at the standard
- Open-Source Design of Heterogeneous SoCs for AI Acceleration: the PULP Platform Experience