AI, and the Real Capacity Crisis in Chip Design
By Stelios Diamantidis, Synopsys (February 24, 2022)
Chip industry veterans are used to the cyclical nature of semiconductor supply and demand, but the ongoing chip shortage has been particularly tough for many. Supply chain disruptions will likely persist in the coming years and the semiconductor sector is unlikely to return to old norms.
There’s a more pressing crisis on the horizon, however, that will bring the semiconductor industry to its next turning point: The lack of engineering throughput will remain unless we optimize the chip design process.
Persistent chip shortages appear to be due to relatively short–term economic factors. But if we start thinking about chip design in a different way, it could offer new opportunities for advancements in chip production. Disruptions in semiconductor design certainly didn’t start the global chip shortage, but it’s doing its part to exacerbate the crisis.
To read the full article, click here
Related Semiconductor IP
- Multi-channel, multi-rate Ethernet aggregator - 10G to 400G AX (e.g., AI)
- Multi-channel, multi-rate Ethernet aggregator - 10G to 800G DX
- 200G/400G/800G Ethernet PCS/FEC
- 50G/100G MAC/PCS/FEC
- 25G/10G/SGMII/ 1000BASE-X PCS and MAC
Related White Papers
- Bigger Chips, More IPs, and Mounting Challenges in Addressing the Growing Complexity of SoC Design
- Differentiation Through the Chip Design and Verification Flow
- Integrating VESA DSC and MIPI DSI in a System-on-Chip (SoC): Addressing Design Challenges and Leveraging Arasan IP Portfolio
- The role of cache in AI processor design
Latest White Papers
- e-GPU: An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications
- How to design secure SoCs, Part II: Key Management
- Seven Key Advantages of Implementing eFPGA with Soft IP vs. Hard IP
- Hardware vs. Software Implementation of Warp-Level Features in Vortex RISC-V GPU
- Data Movement Is the Energy Bottleneck of Today’s SoCs