Xilinx Envisions its Future Without Huawei
By Barbara Jorgensen, EETimes
October 24, 2019
Xilinx Inc. is planning a future that does not include Huawei Technologies, CEO Victor Peng told analysts yesterday.
The chip maker has not received the necessary approvals to ship products to the Chinese networking giant, which the U.S. government has deemed a security risk.
Xilinx shipped $50 million worth of product to Huawei in its first fiscal (June) quarter -- just prior to U.S. trade restrictions imposed in May. “Considering the continued trade restrictions with Huawei and the uncertainty presented to our business, we believe it is prudent to remove all remaining revenue expectations related to Huawei from our fiscal 2020 outlook,” Peng said.
To read the full article, click here
Related Semiconductor IP
- Hardware Security Module (HSM) for AMD Xilinx Versal ACAP device
- Hardware Security Module (HSM) for Xilinx Zynq UltraScale+ MPSoC platform
- ARC4 Core for Xilinx FPG
- Xilinx Virtual Cable
- Xilinx HMC Controller
Related News
- Xilinx and Huawei Announce the First FPGA Cloud-based Real-time Video Streaming Solution in China
- TSMC Intends to Expand Its Investment in the United States to US$165 Billion to Power the Future of AI
- Nokia, Huawei sign W-CDMA patent licensing deal
- Breakthrough IP from Arithmatica Boosts Silicon Performance, Reduces Chip Area without Changing Design Process
Latest News
- BrainChip and Parsons Sign Strategic Agreement to Accelerate Edge AI Defense Systems
- Ainekko Brings Open-Source Principles to AI Hardware with Launch of AI Foundry
- Arteris Selected by Axelera AI to Accelerate Computer Vision for Edge Devices
- Preliminary Characterisation Report for Perceptia’s pPLL08W in GF 22FDX Now Available
- VSORA Launches Europe’s Most Powerful AI Inference Chip