The truth about last year's Xbox 360 recall
(06/09/2008 8:52 PM EDT)
ANAHEIM, Calif
. — When Microsoft Corp. announced a mammoth global recall of its Xbox 360 a year ago, the software giant never disclosed the exact source of the game console's heat problem that led to the fiasco.
Now, in an unlikely venue at Design Automation Conference here, Bryan Lewis, research vice president and chief analyst at Gartner, disclosed that the problem started in a graphic chip. Lewis offered this offhand revelation while discussing the changing ASIC and ASSP landscape for his DAC audience.
The Xbox 360 recall a year ago happened because "Microsoft wanted to avoid an ASIC vendor," said Lewis. Microsoft designed the graphic chip on its own, cut a traditional ASIC vendor out of the process and went straight to Taiwan Semiconductor Manufacturing Co. Ltd., he explained.
To read the full article, click here
Related Semiconductor IP
- Multi-channel, multi-rate Ethernet aggregator - 10G to 400G AX (e.g., AI)
- Multi-channel, multi-rate Ethernet aggregator - 10G to 800G DX
- 200G/400G/800G Ethernet PCS/FEC
- 50G/100G MAC/PCS/FEC
- 25G/10G/SGMII/ 1000BASE-X PCS and MAC
Related News
- IBM delivers Power-based chip for Microsoft Xbox 360 worldwide launch
- Chartered and Microsoft Sign 65-Nanometer Manufacturing Agreement for Xbox 360 CPU
- Microsoft Embraces TSMC 90nm Embedded DRAM Process for Xbox 360
- Report: Microsoft to become chip company with Xbox
Latest News
- How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems
- Automotive Industry Charts New Course with RISC-V
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale