U.S. Chip Makers Embrace Collaboration
By George Leopold, EETimes (May 21, 2021)
As Congress debates funding levels for reviving U.S. chip manufacturing, commercial partnerships are forming around strategic technologies such as 5G wireless and AI chips.
In a bid to accelerate 5G wireless connectivity, GlobalFoundries is licensing gallium nitride technology from Raytheon Technologies. This collaboration is aimed at boosting not just 5G, but also subsequent 6G wireless infrastructure applications.
Meanwhile, IBM is touting its pivot to a “collaborative model” with foundry partners such as Intel and Samsung Electronics to fabricate its Power processors while developing energy-efficient AI chips.
GlobalFoundries said the wireless chip partnership announced Wednesday (May 19) includes joint development and commercialization of Raytheon’s GaN-on-silicon technology. The resulting devices would be aimed at boosting RF performance for 5G and 6G phones and wireless networks.
The foundry has yet to respond to our request for details on performance improvements.
To read the full article, click here
Related Semiconductor IP
- SHA-256 Secure Hash Algorithm IP Core
- EdDSA Curve25519 signature generation engine
- DeWarp IP
- 6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
- LunaNet AFS LDPC Encoder and Decoder IP Core
Related News
- Intel, Micron, and Analog Devices Join MITRE Engenuity's Semiconductor Alliance to Define Principles for Joint Research and Collaboration for a More Resilient U.S. Semiconductor Industry
- PDF Solutions and proteanTecs Announce Collaboration to Deliver Combined Solutions for Semiconductor Analytics to Address the Needs of Data Centers and Automotive Makers
- Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs, Redefining the Market Landscape, Says TrendForce
- GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth
Latest News
- Rebellions Collaborates with SK Telecom and Arm Targeting Sovereign AI and Telecom Infrastructure
- Sarcina Launches UCIe-A/S Packaging IP to Accelerate Chiplet Architectures
- BrainChip Unveils Radar Reference Platform to Bridge the ‘Identification Gap’ in Edge AI
- Siemens accelerates AI chip verification to trillion‑cycle scale with NVIDIA technology
- SiFive Raises $400 Million to Accelerate High-Performance RISC-V Data Center Solutions; Company Valuation Now Stands at $3.65 Billion