TSMC Work on 5nm Process Leaves EUV Undecided
Alan Patterson, EETimes
12/15/2015 00:00 AM EST
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest foundry, said it has started work on a 5nm process to push ahead its most advanced technology, yet the company remains undecided on the adoption of extreme ultraviolet lithography at that node.
TSMC Co-CEO Mark Liu made the comments about the company’s 5nm work at a supply chain management conference in Hsinchu, Taiwan earlier this month. The company, which hasn’t yet put 5nm on its product roadmap, is still evaluating whether to use extreme ultraviolet (EUV) lithography as part of the process.
To read the full article, click here
Related Semiconductor IP
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- HBM3 PHY V2 (Hard) - TSMC N3P
- USB4 Gen3 x2-lane PHY, TSMC N5, 1.2V, N/S orientation, type-C
Related News
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- M31 Launches ONFi5.1 I/O IP on TSMC 5nm Process
- eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips
- M31 Launches USB4 IP for TSMC 5nm Process
Latest News
- Jim Keller: ‘Whatever Nvidia Does, We’ll Do The Opposite’
- FlexGen Streamlines NoC Design as AI Demands Grow
- IntoPIX Presents Its New Titanium Software Suite: Empowering AV-Over-IP Workflows With Speed, Quality & Interoperability
- Global Semiconductor Sales Increase 2.5% Month-to-Month in April
- Speedata Raises $44M to Launch First-Ever Chip Designed Specifically for Accelerating Big Data Analytics - Compute's Second Largest Workload