TSMC plans 1.6nm process for 2026
By Nick Flaherty, eeNews Europe (April 25, 2024)
TSMC is planning a 1.6nm process, called A16, for production in 2026 alongside a wafer-scale chiplet substrate and an automotive chiplet process.
The A16 process uses the TSMC Super Power Rail architecture with its nanosheet transistors for planned production in 2026. It improves logic density and performance by dedicating front-side routing resources to signals for high performance computing and AI chips with complex signal routes and dense power delivery networks. This will take on Intel’s backside power architecture that is key to the 18A and 14A process nodes.
The A16 TSMC process will provide 8-10% speed improvement at the same supply voltage as the N2P 2nm process, 15-20% power reduction at the same speed, and up to 1.10X chip density improvement.
To read the full article, click here
Related Semiconductor IP
- Xtal Oscillator on TSMC CLN7FF
- Wide Range Programmable Integer PLL on UMC L65LL
- Wide Range Programmable Integer PLL on UMC L130EHS
- Wide Range Programmable Integer PLL on TSMC CLN90G-GT-LP
- Wide Range Programmable Integer PLL on TSMC CLN80GC
Related News
- Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era
- Synopsys Accelerates Advanced Chip Design with First-Pass Silicon Success of IP Portfolio on TSMC 3nm Process
- MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
- Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP
Latest News
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- The world’s first open source security chip hits production with Google
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing