Top 20 predictions for semis in 2009
Mark LaPedus, EE Times
(12/30/2008 1:05 PM EST)
(12/30/2008 1:05 PM EST)
Happy New Year! 2009 is just beginning to unfold in the electronics industry and there is already uncertainty in the air based on recent industry data.
Industry forecasters seem to have different opinions about the overall outlook for the semiconductor and IC-equipment markets in 2009 and beyond.
To help sort out the confusion in the market, I have released my own chip forecasts--and other predictions--for 2009.
- Downturn or depression?
- The (fab-tool) sky is falling
- EDA--Down and out?
- Here comes the sun
- Bailout blues
- Memory lane
- Flash dance
- Abu Dhabi vs. Intel
- Foundry fools
- Analog ailments
- FPGA vs. ASICs
- Who's on hot seat?
- Who will not make it?
- Litho blues
- 450-mm conspiracy
- Throw in the towel
- Solar or bust
- Semi IP is not a loser
- Fab vs. fabless
- Walmart rules
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Top 10 Foundries Report Nearly 20% QoQ Revenue Decline in 1Q23, Continued Slide Expected in Q2, Says TrendForce
- Doubts remain about Chartered Semi's recovery
- Top 100 OEMs said to take 76% of semis shipped
- Chips&Media to Demonstrate High-definition Video Encoding Technology at MWC 2009
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack