Texas Instruments Develops Clock Generators for XDR Memory Systems; XCG Clock Generators to Support Next Generation Consumer, Networking, and PC Computing Systems

Rambus Inc. (Nasdaq:RMBS), a leading provider of chip-to-chip interface products and services, and Texas Instruments Incorporated (TI) (NYSE:TXN) today announced they have entered into a licensing agreement allowing Texas Instruments to manufacture clock generators for use in systems using Rambus's XDR(TM) memory interface. The TI XDR Clock Generator (XCG) is a low-jitter clock generator chip providing a clocking solution for a broad range of high performance applications demanding high bandwidth memory, including consumer, networking, and PC computing systems.

"Higher memory bandwidth requirements are creating demand for higher clock speeds in today's advanced applications," said Mike Bartlett, TI vice president of high speed communications and controls. "By developing the XCG, we will be able to provide our customers with a viable, proven solution that meets the needs of various next generation applications. The development of the XCG will expand on the roadmap of Rambus clock generators from TI. TI was the first supplier to be qualified by Rambus for the 533MHz RDRAM Clock Generator."

"Our XDR memory interface continues to gain momentum and support from industry leaders," said Laura Stark, vice president of the Memory Interface Division at Rambus. "As an active developer of XCG, Texas Instruments can become a dependable, high volume source for XCGs in the market."

The XDR memory interface provides a quantum leap in performance in memory signaling while lowering system cost through pin-count reduction and support for low-cost, high-volume PCBs and packages. XDR DRAMs, based on Rambus's XDR memory interface technology, are eight times faster than today's best-in-class PC memory and are expected to achieve data rates of 3.2 to 6.4 GHz and beyond, offering system bandwidths up to 100GBytes/s over a 128-bit memory data bus.

About Rambus Inc.

Rambus is a leading provider of chip-to-chip interface products and services. The company's breakthrough technology and engineering expertise have helped leading chip and system companies to solve their challenging I/O problems and bring industry-leading products to market. Rambus' interface solutions can be found in numerous computing, consumer electronic and networking products. Additional information is available at www.rambus.com.

About Texas Instruments (TI)

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries. Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at: http://www.ti.com.

Rambus is a registered trademark of Rambus Inc. All other registered trademarks and other trademarks that may be mentioned in this release belong to their respective owners.

This release contains forward-looking statements that are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements include statements about the adoption rate of XDR DRAMs and XDR Clock Generators (XCG) into and suitability for the consumer, graphics, networking, PC main memory, server and mobile markets, as well as the dates of when XDR DRAMs and XCGs are expected to ship into their respective markets and ramp into volume production. These forward-looking statements are subject to risks and uncertainties, which could cause actual results to differ materially from those projected. Those risks include the possibility of inadequate shipments of Rambus XDR memory devices, controllers and clock generators for the specified markets, the market response to these products, the continued deterioration in the DRAM market, any delay in the development of Rambus-based products by licensees, any delay in the development and shipment of new Rambus products, any delay in the development and shipment of products compatible with Rambus products, a strong response of the market to competing technology, a failure to sign new contracts or maintain existing contracts for XDR memory, adverse litigation decisions and other factors that are described in our SEC filings including our 10-K and 10-Qs.

SOURCE: Rambus Inc.