OCP-IP Delivers New Advanced SystemC TLM Kit
First and only industry-ready kit leveraging OSCI 2.0 ensures OCP-IP kit is the most advanced and complete offering available
Beaverton ORE. — April 21, 2009 — Open Core Protocol International Partnership (OCP-IP) today announced the availability of the SystemC TLM kit for OCP. The new kit represents the first, and most advanced TLM-2.0 based, industry-ready kit in existence today. It should be the first port of call for the entire ESL world. The work by OCP-IP’s System Level Design Working Group significantly increases performance, ease of use and ensures alignment with the OSCI 2.0 standard. The kits are free as part of OCP-IP membership entitlement and will save users hundreds of thousands of dollars each year in development, documentation, and training cost which would be required to develop such kits independently.
The new offering leverages OSCI 2.0 for all levels of abstraction and now includes TL4 which is equivalent to OSCI's "loosely-timed” (LT) level. TL1 is fully cycle-accurate, including support for clock cycle synchronization and combinatorial paths. TL2 handles intra-burst timing. TL3 and TL4: inter-burst or no timing, equivalent to OSCI’s Base Protocol.
The new kit includes everything needed for immediate use. For a detailed listing of everything included see a copy of the OCP SystemC TLM Kits datasheet. A fully functional version of the kit without monitors is also available to non-members, via click through research license agreement from www.ocpip.org.
This kit was developed by OCP-IP member companies working with Greensocs, Ltd. It interoperates seamlessly with other TLM utilities, such as GreenSocket from GreenSocs.
“By providing a standardized OCP- based communication kit, OCP-IP members no longer need to independently resolve how to implement interface protocols, and test these implementations,” said Rich Wawrzyniak Senior Analyst ASICs and SoC for Semico Research Corporation. “The new kit further extends the high level support and tools OCP-IP provides to their members, allowing them to focus on their critical design goals and maximize their ROI.”
“OCP has a robust, thriving infrastructure driven by many independent companies providing leading-edge services and products,” said Mackintosh. “We are proud of the tremendous work completed by our System Level Design Working Group in delivering the most advanced TLM kit.”
For the latest information on OCP-IP please see our newsletter at http://www.ocpip.org/pressroom/newsletters/
About OCP-IP
Formed in 2001, OCP-IP is a non-profit corporation promoting, supporting and delivering the only openly licensed, core-centric protocol comprehensively fulfilling integration requirements of heterogeneous multicore systems. The Open Core Protocol (OCP) facilitates IP core reusability and reduces design time, risk, and manufacturing costs for all SoC and electronic designs by providing a comprehensive supporting infrastructure. For additional background and membership information, visit www.OCPIP.org.
Beaverton ORE. — April 21, 2009 — Open Core Protocol International Partnership (OCP-IP) today announced the availability of the SystemC TLM kit for OCP. The new kit represents the first, and most advanced TLM-2.0 based, industry-ready kit in existence today. It should be the first port of call for the entire ESL world. The work by OCP-IP’s System Level Design Working Group significantly increases performance, ease of use and ensures alignment with the OSCI 2.0 standard. The kits are free as part of OCP-IP membership entitlement and will save users hundreds of thousands of dollars each year in development, documentation, and training cost which would be required to develop such kits independently.
The new offering leverages OSCI 2.0 for all levels of abstraction and now includes TL4 which is equivalent to OSCI's "loosely-timed” (LT) level. TL1 is fully cycle-accurate, including support for clock cycle synchronization and combinatorial paths. TL2 handles intra-burst timing. TL3 and TL4: inter-burst or no timing, equivalent to OSCI’s Base Protocol.
The new kit includes everything needed for immediate use. For a detailed listing of everything included see a copy of the OCP SystemC TLM Kits datasheet. A fully functional version of the kit without monitors is also available to non-members, via click through research license agreement from www.ocpip.org.
This kit was developed by OCP-IP member companies working with Greensocs, Ltd. It interoperates seamlessly with other TLM utilities, such as GreenSocket from GreenSocs.
“By providing a standardized OCP- based communication kit, OCP-IP members no longer need to independently resolve how to implement interface protocols, and test these implementations,” said Rich Wawrzyniak Senior Analyst ASICs and SoC for Semico Research Corporation. “The new kit further extends the high level support and tools OCP-IP provides to their members, allowing them to focus on their critical design goals and maximize their ROI.”
“OCP has a robust, thriving infrastructure driven by many independent companies providing leading-edge services and products,” said Mackintosh. “We are proud of the tremendous work completed by our System Level Design Working Group in delivering the most advanced TLM kit.”
For the latest information on OCP-IP please see our newsletter at http://www.ocpip.org/pressroom/newsletters/
About OCP-IP
Formed in 2001, OCP-IP is a non-profit corporation promoting, supporting and delivering the only openly licensed, core-centric protocol comprehensively fulfilling integration requirements of heterogeneous multicore systems. The Open Core Protocol (OCP) facilitates IP core reusability and reduces design time, risk, and manufacturing costs for all SoC and electronic designs by providing a comprehensive supporting infrastructure. For additional background and membership information, visit www.OCPIP.org.
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
- SHA-256 Secure Hash Algorithm IP Core
Related News
- The Open SystemC Initiative and the Open Core Protocol International Partnership Join Forces to Target TLM Layer Standardization
- Open SystemC Initiative Announces Proposal for Significant Extensions to Transaction-Level Modeling (TLM) Standard
- Synopsys Contributes Virtual Platform Technology to OSCI SystemC TLM 2.0 Standardization Effort
- CoWare and STARC Integrate SystemC TLM Methodology
Latest News
- Sofics and Alcyon Photonics Partner to Support Next-Generation Photonic Systems
- QuickLogic Appoints Quantum Leap Solutions as Authorized Sales Representative
- Cadence and NVIDIA Expand Partnership to Reinvent Engineering for the Age of AI and Accelerated Computing
- Cadence and Google Collaborate to Scale AI-Driven Chip Design with ChipStack AI Super Agent on Google Cloud
- Analog Bits Demonstrates Real-Time On-Chip Power Sensing and Delivery on TSMC N2P Process at TSMC 2026 Technology Symposiums