Silicon Image Announces Resignation of CFO Darrel Slack
Interim CFO Appointed in August Remains In Place
SUNNYVALE, Calif., September 21, 2005 - Silicon Image, Inc. (Nasdaq: SIMG), a leader in multi-gigabit semiconductor solutions for the secure transmission and storage of rich digital media, today announced the resignation of chief financial officer, Darrel Slack, who will be moving on to pursue other opportunities. Slack also resigned from the Silicon Image board of directors and the HDMI Licensing, LLC board of directors.
Silicon Image has retained the services of Spencer Stuart, a leading global executive search firm, to assist in the search for a new CFO. In August 2005, the company announced the appointment of Robert R. Freeman, 63, a seasoned, operations-oriented CFO with multi-industry experience, as interim chief financial officer while Slack took a six week personal leave of absence.
About Silicon Image
Headquartered in Sunnyvale, Calif., Silicon Image, Inc. designs, develops and markets multi-gigabit semiconductor and system solutions for a variety of communications applications demanding high-bandwidth capability. With its proprietary Multi-layer Serial Link (MSL™) architecture, Silicon Image is well positioned for leadership in multiple mass markets including PCs, consumer electronics and storage. Currently, Silicon Image leads the global PC/display arena with its innovative digital interconnect technology, and has emerged as a leading player in the consumer electronics and storage markets by offering robust, high-bandwidth semiconductors. For more information on Silicon Image, visit www.siliconimage.com
SUNNYVALE, Calif., September 21, 2005 - Silicon Image, Inc. (Nasdaq: SIMG), a leader in multi-gigabit semiconductor solutions for the secure transmission and storage of rich digital media, today announced the resignation of chief financial officer, Darrel Slack, who will be moving on to pursue other opportunities. Slack also resigned from the Silicon Image board of directors and the HDMI Licensing, LLC board of directors.
Silicon Image has retained the services of Spencer Stuart, a leading global executive search firm, to assist in the search for a new CFO. In August 2005, the company announced the appointment of Robert R. Freeman, 63, a seasoned, operations-oriented CFO with multi-industry experience, as interim chief financial officer while Slack took a six week personal leave of absence.
About Silicon Image
Headquartered in Sunnyvale, Calif., Silicon Image, Inc. designs, develops and markets multi-gigabit semiconductor and system solutions for a variety of communications applications demanding high-bandwidth capability. With its proprietary Multi-layer Serial Link (MSL™) architecture, Silicon Image is well positioned for leadership in multiple mass markets including PCs, consumer electronics and storage. Currently, Silicon Image leads the global PC/display arena with its innovative digital interconnect technology, and has emerged as a leading player in the consumer electronics and storage markets by offering robust, high-bandwidth semiconductors. For more information on Silicon Image, visit www.siliconimage.com
Related Semiconductor IP
- Multi-channel, multi-rate Ethernet aggregator - 10G to 400G AX (e.g., AI)
- Multi-channel, multi-rate Ethernet aggregator - 10G to 800G DX
- 200G/400G/800G Ethernet PCS/FEC
- 50G/100G MAC/PCS/FEC
- 25G/10G/SGMII/ 1000BASE-X PCS and MAC
Related News
- Virage Logic Announces Resignation of CFO -- Chairman Dan McCranie to Serve as Interim CFO
- BOPS Appoints Victor Young as Its CFO
- Monolithic System Technology, Inc. CFO F.Judson Mitchell Retires
- LogicVision Names Bruce M. Jaffe as CFO
Latest News
- How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems
- Automotive Industry Charts New Course with RISC-V
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale