SIDSA announces DVB-H chip and intellectual property for digital television for mobile telephones
SIDSA’s DVB-H solution is available as FPGA prototype hardware for broadcaster field trials; the first IC (chip) is scheduled for 2005
September 10, 2004 -- The DVB-H design implements the COFDM demodulator, MPE-FEC (Multi- Protocol Encapsulation) and advanced power control, essential for television on mobile phones. It provides good communication robustness for all communications conditions.
The company intends to pursue a dual strategy of intellectual property licensing for certain markets and making its own ICs (chips) for other mobile “handheld” digital TV reception applications. SIDSA is one of the few providers of a DVB-H “foundry independent” solution meaning that the DVB-H design block can be implemented by third parties in a chip made in any silicon foundry.
The DVB-H design allows vertical integration with SIDSA’s audiovisual content protection (CAS) products for encrypted television transmissions at transport stream and IP level.
SIDSA (Semiconductors Design Solutions) supplies ICs for DVB digital television reception and provides conditional access software. With offices in Madrid and Silicon Valley, it has been operating for the last 12 years in international markets. SIDSA activities include complete chip design, multimedia products for STB and CAMs based on proprietary chips and content protection software(CAS).
Related Semiconductor IP
- Very Low Latency BCH Codec
- 5G-NTN Modem IP for Satellite User Terminals
- 400G UDP/IP Hardware Protocol Stack
- AXI-S Protocol Layer for UCIe
- HBM4E Controller IP
Related News
- Intellectual Property Servicing Centre Opens at Hong Kong Science Park; Establishes IP Servicing Platform for the Semiconductor Industry
- Summit Design Launches Intellectual Property Initiative to Enable Consistent, Pre-Verified, Multi-Vendor Compatible IP
- The TPL Group Names F. Eric Saunders Chief Counsel for Intellectual Property (IP) and Dennis Miller Vice President of IP Development Engineering
- Impinj Stages Semiconductor Industry Event; Panel of Chip Intellectual Property Experts to Discuss Role of Logic Nonvolatile Memory in High Growth Electronics Markets
Latest News
- Movellus Partners with Synopsys to Deliver Power Efficiency for Next Generation IC’s
- BrainChip Enables the Next Generation of Always-On Wearables with the AkidaTag© Reference Platform
- eSOL and Quintauris Partner to Expand Software Integration in RISC-V Automotive Platforms
- PQShield unveils ultra-small PQC embedded security breakthroughs
- CAST Introduces 400 Gbps UDP/IP Hardware Stack IP Core for High-Performance ASIC Designs