Analysis: Plug-and-play IP goal remains elusive
(02/09/2009 2:28 AM EST)
SANTA CLARA, Calif.—Intellectual property (IP) was a hot topic at the DesignCon show here last week, with frustration over the quality of IP and business models that are described as immature being knocked more than once.
Users continue to bemoan the dearth of standards and effective quality metrics that they say would help greatly in confidently selecting IP. But several speakers in panel discussions here highlighted reasons why what sounds like a straightforward issue is infinitely more complex. And, many said, the only way to be truly successful in selecting and implementing IP is through deep vendor-customer collaboration.
During a panel on IP selection, an audience member voiced the observation that chips are like the printed circuit boards of yesteryear, with IP cores acting in the role once occupied by standard components. He likened stitching together an SoC using several IP blocks to slapping components onto a pc board to build a system.
But several audience members disagreed, noting that, among other things, standard components can be evaluated by datasheets and performance benchmarking that describe exactly what each device will do. For the most part, the IP business still offers nothing comparable.
To read the full article, click here
Related Semiconductor IP
- USB 20Gbps Device Controller
- SM4 Cipher Engine
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- Virage Logic Is the First IP Company to Ensure Plug-and-Play SoC Core Testing
- Inspiration Technologies releases CSIX and USB plug-and-play Openvera verification intellectual property solutions
- Zoran's Multimedia Technology Enables Industry's First Plug-and-Play Motion JPEG USB 2.0 Reference Design, Demonstrated at Comdex 2002
- Altera Uses Verisity's Plug-and-Play Components to Speed Verification of its Intellectual Property
Latest News
- Analog Bits Adds New Power and Energy Management IP Blocks Proven on TSMC N2P and N3P Processes at TSMC 2025 OIP Ecosystem Forum
- EnSilica and Codasip announce strategic partnership
- Empower Semiconductor Secures Over $140M in Series D Financing
- Siemens unveils groundbreaking Tessent AnalogTest software for automated analog circuit test generation
- Euclyd Unveils CRAFTWERK: The World’s Most Power-Efficient Exascale Token Factory for Agentic AI