Philips, STMicro to bundle hardware/software platforms for digital TV, set-top boxes
Philips, STMicro to bundle hardware/software platforms for digital TV, set-top boxes
By Semiconductor Business News
February 26, 2002 (9:02 a.m. EST)
URL: http://www.eetimes.com/story/OEG20020226S0005
EINDHOVEN, the Netherlands -- Royal Philips Electronics N.V. and STMicroelectronics today announced an agreement to jointly develop platform products for set-top boxes and digital television sets. The alliance will apply Philips' software for multimedia home platforms and STMicroelectronics' single-chip digital decoder to provide new turnkey solutions. Philips here and STMicroelectronics based near Geneva said the turnkey solutions will help to dramatically reduce the development and production time for new set-top boxed and integrated digital TV sets. Both companies will develop and market pre-integrated solutions of the Philips MHP 1.0.x Software Platform and ST's Omega series of digital set-top box decoder chips. In Europe and Asia, the new DVB-MHP open standard for interactive digital television is providing a platform for software and content development, said Philips managers. Philips Softworks, a business unit of Philips Digital Net works, has developed and implemented an MHP 1.0.1-compliant software 'stack' offering full interactive digital television functionality. "These software bundles dramatically cut product development and production times for set-top box and TV manufacturers looking to enter the digital market in a fast and flexible way," said Frank Bosveld, general manager of Philips Softworks. Reference systems combining hardware and software for integrated operation will make use of technologies from both ST and Philips. Under the new agreement, ST will work with Philips to jointly market MHP Reference Systems based on the Omega series of set-top box decoders. Demonstration models are scheduled to be available in early 2002 with a complete reference system in product quality following in the middle of this year.
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- Neuromorphic Processor IP
- Lossless & Lossy Frame Compression IP
Related News
- RIKEN adopts Siemens' emulation and High-Level Synthesis platforms for next-generation AI device research
- Amino will Port Advanced Software Stack For IPTV Set-Top Boxes on Philips' Semiconductors Reference Design
- Siemens announces certifications for TSMC's latest processes, celebrates recent achievements for Siemens and TSMC collaboration
- MAXEYE License and Deploy CEVA Sensor Fusion Software in Digital Pen for Leading Global Mobile OEM
Latest News
- SignatureIP Achieves PCI-SIG® PCIe® 5.0 Certification, Joining Elite Group on Official Integrators List
- GUC Monthly Sales Report – August 2025
- eSOL and Infineon Enter Strategic Partnership for Next-generation Automotive Platforms Based on RISC-V/TriCore/Arm Microcontrollers
- Synopsys and GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
- Cadence to Acquire Hexagon’s Design & Engineering Business, Accelerating Expansion in Physical AI and System Design and Analysis