Philips Semiconductors (Eindhoven, Netherlands) and Tality Corp. (San Jose, Calif.) prep Bluetooth reference modules
Pair preps Bluetooth reference modules
By Patrick Mannion, EE Times
June 1, 2001 (3:53 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010601S0055
MANHASSET, N.Y. Philips Semiconductors (Eindhoven, Netherlands) and Tality Corp. (San Jose, Calif.) will soon release the first in a series of jointly developed reference modules that they said will function as complete embedded Bluetooth systems. The modules will significantly reduce time-to-market for Bluetooth products while increasing the probability of first-time interoperability, the companies said. Philips Semiconductors is providing the modules' RF and baseband ICs, and Tality is providing its protocol stack and application profiles. Tality, the former Electronic Design Services unit of Cadence Design Systems Inc., will provide system integration services with the modules, which will also be available for license by those wishing to design systems themselves. The first module, measuring 21 by 15 mm, will be released in the second quarte r.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Philips to use Tality for 8051 shrinks
- Philips Semi, Cadence's Tality unit team up in Bluetooth solutions
- True Circuits PLL and DLL Hard Macros Featured at TSMC Technology Symposiums in San Jose and Boston
- MemCon San Jose 2006 to Feature Windows Vista Symposium
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack