Philips Semi, Cadence's Tality unit team up in Bluetooth solutions
Philips Semi, Cadence's Tality unit team up in Bluetooth solutions
By Semiconductor Business News
June 6, 2001 (4:26 a.m. EST)
URL: http://www.eetimes.com/story/OEG20010606S0002
Philips Semiconductors announced a strategic partnership with the design services subsidiary of Cadence Design Systems Inc to provide complete embedded solutions for wireless connections using Bluetooth radio-frequency links The design-services partnership for system manufacturers aimed at increasing the chances of first-time interoperability with other Bluetooth products, said Philips and Cadence's Tality Corp subsidiary in San Jose, US. First-time design success will increase the profitability of new Bluetooth products, noted the partners. The chip division of Royal Philips Electronics NV claims to be the only semiconductor supplier to sell more than one million Bluetooth baseband ICs. "This partnership will help our customers bring Bluetooth products to market rapidly and at low risk," said Gerhard Heider, manager of connectivity products at Philips Semiconductors. Under the partnership, Tality will supply Bluetooth reference modules that use baseband and RF integrated circuits from Philips. The Cadence design subsidiary company will also include its own protocol stack and application profile software with the reference design platforms. The first modules--measuring 21-by-15mm--will be made available to Bluetooth customers within the next month. "Tality has accumulated design expertise in over 30 Bluetooth system and chip designs, has a proven protocol stack, a full suite of application profiles, and has frequently demonstrated Bluetooth system interoperability," said Simon Jones, general manager of Tality's Bluetooth Business Group.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Philips to use Tality for 8051 shrinks
- Philips Semiconductors (Eindhoven, Netherlands) and Tality Corp. (San Jose, Calif.) prep Bluetooth reference modules
- Cadence spins off services unit at Tality
- Semidynamics announces largest, fully customisable Vector Unit in the RISC-V market, delivering up to 2048b of computation per cycle for unprecedented data handling
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack