Philips licenses MoSys 1T-SRAM with error correction for 0.13-micron designs
Philips licenses MoSys 1T-SRAM with error correction for 0.13-micron designs
By Semiconductor Business News
April 18, 2002 (2:29 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020418S0021
SUNNYVALE, Calif.-- MoSys Inc. today announced it has licensed its one-transistor SRAM cell technology, called T1-SRAM, to Philips Semiconductors, which plans to use the embedded memory in cellular infrastructure ASICs and system-on-chip (SoC) designs. The license agreement will initially be used for products fabricated with 0.13-micron process technology. The semiconductor division of Royal Philips Electronics N.V. in the Netherlands plans to use MoSys' recently announced 1T-SRAM-R technology, which incorporates error correction to eliminate the need for the laser repair in manufacturing while providing improved soft error rate, yield, and reliability (see Jan. 28 story). Terms of the licensing agreement were not released. "The 1T-SRAM embedded memory was evaluated according to our cellular infrastructure customer requirements, and we selected MoSys technology for it s unique performance, density and power capabilities not available from other standard [six-transistor cell] SRAM technologies," said Malcolm Spencer, general manager Cellular Infrastructure business line at Philips Semiconductors.
Related Semiconductor IP
- HBM4 PHY IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- VIP for Compute Express Link (CXL)
Related News
- MoSys adds soft-error protection, correction to 1-transistor SRAM for 'free'
- Cypress taps ProMOS for 1T SRAM technology
- Xilinx enables flexible and low cost forward error correction solutions with IP cores optimized for Spartan-IIE FPGAs
- ATMOS Corporation Achieves Superior Soft Error Rate Results for SoC-RAM High-Density 1T Embedded Memory at TSMC Test Lab
Latest News
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
- ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract
- TSMC to Lead Rivals at 2-nm Node, Analysts Say
- Energy-efficient RF power modules developed using SOI technology