Palma Ceia SemiDesign Establishes United Kingdom Center
SANTA CLARA, California, Nov. 1, 2019 -- Palma Ceia SemiDesign, a provider of next-generation wireless connectivity solutions, today announced the opening of a design center in Cambridge, United Kingdom. This addition will expand research & development efforts and support the company's growing worldwide customer base.
The expansion will accelerate IoT chip product development by bringing additional world-class design and production experience to Palma Ceia SemiDesign. The Cambridge team will work with a growing worldwide engineering team building advanced IoT connectivity products. The new design center adds critical resources necessary to achieve the company's mission to bring new and innovative IoT products and services to the market.
"Our decision to open our newest design center in the UK is another step in our continued growth to become a leading wireless IC supplier," said Roy E. Jewell, president and CEO of Palma Ceia SemiDesign. "It will enable us to access a very experienced base of wireless designers in the UK, thus more quickly broadening our connectivity product offering, and provide greater service and support to our growing customer base worldwide."
The Cambridge UK Technology Cluster, also known as Silicon Fen, has been at the forefront of mixed-signal SoC design since its inception. The Cambridge design center draws on the region's depth of experience in mixed-mode SoC design and includes engineers who have been responsible for key innovations in driving forward large-scale integration of CMOS radio designs for cellular, PAN and WAN standards. The team includes world-class RF, analog, digital and DSP engineering expertise with a proven track record of over 2 billion device deliveries.
The addition of the Cambridge team is the latest step in the global expansion Palma Ceia SemiDesign began in 2017. It follows the recent opening of facilities in Hong Kong and China. Contact information is available on the Palma Ceia SemiDesign website.
About Palma Ceia SemiDesign
Palma Ceia SemiDesign is a provider of communication IP and chips for next-generation WiFi and cellular applications. With a focus on emerging WiFi and LTE standards, PCS targets the design of ICs for broadband, wireless, medical and automotive applications. Palma Ceia solutions are differentiated by low-power, high-performance and ease of integration. With operational headquarters in Hong Kong, the company has its North American operations headquartered in Santa Clara, Calif., and original design center in McKinney, Texas. Additional sales and support activities are located in greater China, Israel, Japan, Korea, Taiwan and the United Kingdom. Visit Palma Ceia SemiDesign on the web at www.pcsemi.com.
Related Semiconductor IP
- Highly-optimized PQC implementations, capable of running PQC in under 15kb RAM
- Cryptographic Cores IP
- DVB-S2X Wideband LDPC/ BCH Encoder
- Audio Sample Rate Converter
- 1-56Gbps Serdes - 7nm (Multi-reference Clock)
Related News
- SCALINX expansion continues with ASIC design center in Caen, France
- Flex Logix Launches InferX X1 Edge Inference Co-Processor That Delivers Near-Data Center Throughput at a Fraction of the Power and Cost
- Synopsys Establishes Center of Excellence with STMicroelectronics to Speed Development of Automotive Electronic Systems
- Cadence Palladium and Protium Platforms Enable Innovium to Accelerate First-Pass Silicon Success for the Data Center Market
Latest News
- Worldwide Silicon Wafer Shipments Increase 2% Year-on-Year in Q1 2025
- xMEMS Extends µCooling Fan-on-a-Chip Technology to AI Data Centers
- Codasip launches complete exploration platform to accelerate CHERI adoption
- Imec coordinates EU Chips Design Platform
- Thalia enhances AMALIA Platform with new AI models to revolutionize analog, RF and mixed-signal IC design migration