Open Core Protocol International Partnership Releases OCP SystemC Channel 2.1.1 and Methodology White Paper
— Open Core Protocol International Partnership (OCP-IP) today announced the availability of the SystemC Transaction Level Monitor (TLM) Channel version 2.1.1 along with a methodology white paper entitled "OCP TLM for Architectural Modeling.” The new features in version 2.1.1 improve model interoperability, resulting in better productivity in system level modeling.
Version 2.1.1 improves module interoperability by unifying the way time is modeled in transaction level 1. Some TL1 API functions have also been redesigned to ensure interoperability, and new timing interfaces have been added to the TL1 channel for automating the setting of module timing parameters. Improved support for OCP thread busy signaling has also been added to TL1. In addition, a wrapper channel, which includes a clock input port is provided for TL1 to make the channel easier to use with EDA tools. Single-request, multiple-data OCP transactions have been implemented for TL2.
The methodology package outlines the use of the OCP TLM in the same flow with the OSCI TLM, and introduces a newly defined modeling abstraction level, Architects View, using OCP TL2 or TL3 for interface modeling. The methodology package has extensive examples for modeling in different abstraction levels, and for making models of different abstractions interoperable.
Work on the compliance models was completed by the OCP-IP System Level Design Working Group including representatives from: CoWare, Nokia, Sonics, and TI.
“Our System Level Design Working Group is full of the best and brightest engineers in the world from leading companies working on Transaction Level Models,” said Ian Mackintosh, president OCP-IP. “We are particularly proud of the quality and ongoing evolution of the modeling standard we have pioneered.”
For more information please visit the OCP-IP website at www.ocpip.org.
About OCP-IP
The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants are: Nokia [NYSE: NOK], Texas Instruments [NYSE: TXN], STMicroelectronics [NYSE: STM], Toshiba Semiconductor Group (including Toshiba America TAEC), and Sonics. OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs. VSIA endorses the OCP socket, and OCP-IP is affiliated with VSIA. For additional background and membership information, visit www.OCPIP.org.
Related Semiconductor IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
- High Speed Ethernet 2/4/8-Lane 200G/400G PCS
Related News
- Open Core Protocol International Partnership Releases OCP SystemC Channel Version 2.1.2
- Open Core Protocol International Partnership Releases OCP SystemC Channel Version 2.1.3
- Open Core Protocol International Partnership Releases OCP SystemC Channel Version 2.2
- 2016 IC Market Forecast Raised from -2% to +1%
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers