NEC shuts fabs, exits structured ASICs
Yoshiko Hara, EE Times
(02/22/2007 1:10 PM EST)
(02/22/2007 1:10 PM EST)
TOKYO — Coping with a ''crisis'' amid losses in its business, troubled NEC Electronics Corp. Thursday (Feb. 22) announced a three-year restructuring plan that included the exit from the structured ASIC and single-chip cell phone sectors. The company, which is also terminating 600 engineers, will consolidate its nine front-end manufacturing lines in Japan to four.
To read the full article, click here
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- 1.8V/3.3V GPIO With I2C Compliant ODIO in GF 55nm
- Verification IP for UALink
Related News
- Altera and PMC-Sierra Extend High-Speed Serial Options for FPGAs and Structured ASICs
- NEC Electronics Introduces the CMOS-12M Series of Mainstream Structured ASICs
- ChipX Accelerates Development of XM Satellite Radio Receivers; ChipX Structured ASICs Provide Fast Turnaround Time, Low Risk to High-volume Production
- Structured ASICs walk a fine line
Latest News
- EXTOLL received GlobalFoundries Award for “Interface IP Partner of the Year”
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications
- GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High-Performance Smart Mobile, Communication and Industrial Applications