LogicVision Names Ronald H. Mabry VP Marketing and Business Development
San Jose, Calif. - July 28, 2003 - LogicVision, Inc., (NASDAQ:LGVN), a leading provider of embedded test for integrated circuits and systems, today announced the appointment of Ronald H. Mabry as vice president, marketing and business development. He will report to Dr. Vinod Agarwal, LogicVision's president and CEO.
"Ron Mabry is an outstanding and timely addition to our team," said Dr. Agarwal. "His extensive experience and business achievement in senior marketing positions within the technology industry will be an important addition to the LogicVision management team."
Mabry comes to LogicVision with nearly 25 years of senior-level management experience in marketing, sales and business development in the United States and in the Asia Pacific region. He most recently served as vice president, sales and marketing for PACT XPP Technologies, a leader in reconfigurable processing technology. Mabry previously worked for eChips, Inc., Bell Microproducts, Western Micro Technology, Avnet, Inc., and Cronin Electronics where he gained broad experience in electronic components, computer systems and mass storage.
"I am excited to join LogicVision at this stage in its growth, and I welcome the opportunity to contribute to the broader adoption of the company's embedded test solutions," said Mabry.
About LogicVision, Inc.
LogicVision provides proprietary technologies for embedded test that enable the more efficient design and manufacture of complex semiconductors. LogicVision's embedded test solution allows integrated circuit designers to embed into a semiconductor design test functionality that can be used during semiconductor production and throughout the useful life of the chip. For more information on the company and its products, please visit the LogicVision website at www.logicvision.com.
FORWARD LOOKING STATEMENTS:
Except for the historical information contained herein, the matters set forth in this press release, including the broader adoption of the company's embedded test solutions, are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are subject to risks and uncertainties that could cause actual results to differ materially, including, but not limited to, the impact of competitive products and technological advances, and other risks detailed in LogicVision's Form 10-Q for the quarter ended March 31, 2003, and from time to time in LogicVision's SEC reports. These forward-looking statements speak only as of the date hereof. LogicVision disclaims any obligation to update these forward-looking statements.
# # #
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Jayson Bethurem Joins Flex Logix as VP Marketing & Business Development
- Rambus Appoints Ronald May as Vice President of Corporate Marketing
- LogicVision Names George Swan VP of Engineering
- What's needed for mixed-signal verification (by Bijan Kiani, Synopsys VP of Marketing)
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack