Moortec to exhibit at the ARM TechCon Expo in Santa Clara
October 12, 2016 -- Moortec will be exhibiting at the ARM TechCon Expo which is taking place in Santa Clara on Wednesday 26th & Thursday 27th of October. The ARM TechCon Expo is a unique opportunity for attendees to learn about groundbreaking solutions, reach out and touch the latest innovations and identify cutting-edge technologies.
Come and meet us at booth 808 and discuss in person how your advanced node System on Chip (SoC) programme can benefit from Moortec’s high performance analog IP.
Moortec specialise in high accuracy, highly featured embedded Process, Voltage and Temperature (PVT) sensors on 28nm and FinFET. Moortec’s IP enables SoC designs to be performance optimised and monitored on a per die basis.
About Moortec
Established in 2005, Moortec provide in-chip monitors and sensors, such as embedded Process Monitors (P), Voltage Monitors (V) and Temperature Sensors (T). Moortec’s PVT monitoring IP products enhance the performance and reliability of today’s Integrated Circuit (silicon chip) designs. Having a track record of delivery to tier-1 semiconductor and product companies, Moortec provide a quick and efficient path to market for customer products and innovations.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 ARM TechCon in Santa Clara
- Moortec to show off its advances in PVT monitoring for 40nm, 28nm, 16nm, 12nm and 7nm at ARM TechCon in San Jose
- Moortec to Showcase its Latest Embedded PVT Monitoring IP for 40nm-5nm at the 2019 ARM TechCon in San Jose
- Moortec Announce route2IP - a Collaborative Initiative for Sub-Picosecond Jitter PLL Design
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack