Interview: ST-Ericsson CEO Alain Dutheil on the LTE rollout
John Walko, EETimes
(02/23/2009 12:01 AM EST)
Barcelona, Spain -- It was touch and go for a while, but the legal and financial folks sorted out the details in time for ST-Ericsson to make its debut here last week at the Mobile World Congress. London editor John Walko caught up with Alain Dutheil, newly installed CEO of the company, which is vying for second in the wireless chip business. It's looking to increase its odds by making the most of a rich portfolio inherited from its three parents: STMicroelectronics, NXP Semiconductors and Ericsson Mobile Platforms (EMP).
4G was on everyone's tongue at the Mobile World Congress, but 3G HSPA handsets and dongles drew the foot traffic.
EE Times: Now that the mergers have been completed, what do you see as the main tasks ahead, and what are the company's targets and opportunities?
(02/23/2009 12:01 AM EST)
Barcelona, Spain -- It was touch and go for a while, but the legal and financial folks sorted out the details in time for ST-Ericsson to make its debut here last week at the Mobile World Congress. London editor John Walko caught up with Alain Dutheil, newly installed CEO of the company, which is vying for second in the wireless chip business. It's looking to increase its odds by making the most of a rich portfolio inherited from its three parents: STMicroelectronics, NXP Semiconductors and Ericsson Mobile Platforms (EMP).
4G was on everyone's tongue at the Mobile World Congress, but 3G HSPA handsets and dongles drew the foot traffic.
EE Times: Now that the mergers have been completed, what do you see as the main tasks ahead, and what are the company's targets and opportunities?
To read the full article, click here
Related Semiconductor IP
- eUSB2V2.0 Controller + PHY IP
- I/O Library with LVDS in SkyWater 90nm
- 50G PON LDPC Encoder/Decoder
- UALink Controller
- RISC-V Debug & Trace IP
Related News
- ST-Ericsson opens the way for a new era of smartphones and announces the world's fastest, coolest integrated LTE Modem and Application Processor platform based on FD-SOI
- ST-Ericsson collaborates with ARM to demonstrate the world's first Symmetric Multi Processing mobile platform technology on Symbian OS
- ST-Ericsson Extends EDGE Leadership with Fully Integrated Single-Chip Solutions for Feature-Rich, Low-Cost Handsets
- ST-Ericsson and ARM In Cooperation To Accelerate Innovation In Mobile User Experience
Latest News
- Qualitas Semiconductor Secures Strategic IP Licensing Agreement for MIPI Solutions
- Chinese RISC-V Chipmaker SpacemiT Launches K3 AI CPU, Highlighting the Rise of Open-Source Hardware in Intelligent Computing
- Weebit Nano Q2 FY26 Quarterly Activities Report
- Arasan announces the immediate availability of the industries first xSPI NOR + eMMC NAND Combo PHY IP
- AMIQ EDA Gives AI Agents Access to Essential Design and Verification Data