Firms push to extend mobile DRAM spec
Mark LaPedus, EETimes
2/22/2011 4:39 PM EST
SAN FRANCISCO – There is a proposed standard to extend mobile DRAM technology to higher speeds-a move that could push out competing next-generation efforts from MIPI, Rambus, Silicon Image and the 3-D chip community.
There are discussions within industry body JEDEC to extend LPDDR2 technology to run at speeds of 800-MHz-and perhaps 1,066-MHz. Elpida, Hynix, Micron and Samsung separately have some or all of these LPDDR2 parts in the works.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- Parameterizable compact BCH codec
- 1G BASE-T Ethernet Verification IP
- Network-on-Chip (NoC)
- Microsecond Channel (MSC/MSC-Plus) Controller
Related News
- Cadence Spectre FX FastSPICE Simulator Is Adopted by SK Hynix to Accelerate DRAM Design
- Servers gas up with 4-Gbyte/s PCI-X 2.0 spec
- Spec eyes 'plug and play' test for virtual components <!-- verification -->
- VSI Alliance updates virtual component interface spec
Latest News
- ISOLDE Project Demonstrates Advancements in European Open-Source RISC-V for Automotive, Space, and IoT
- ACL Digital and AIM FUTURE Partner to Drive Innovation in Edge AI
- Tenstorrent and PwC Partner to Advance AI Ecosystem Development in Cyprus
- Republic of Cyprus Selects Tenstorrent for AI Innovation
- SiFive and IAR Collaborate to Advance the Automotive Ecosystem and Drive RISC-V Innovation in Automotive Electronics