iPhone 7 Sports Intel, TSMC
Rick Merritt, EETimes
9/16/2016 02:20 PM EDT
SAN JOSE, Calif. — A teardown posted today confirmed Apple put Intel inside at least some of its iPhone 7 handsets, using the x86 giant’s baseband processors acquired from Infineon. The report said Apple used TSMC to make at least some of its A10 Fusion SoCs, probably using its InFO packaging process as well.
Both Intel and TSMC were expected to win the sockets in the latest iPhones announced earlier this month. The teardowns confirm earlier reports of deals that represent millions of dollars of business to both companies, probably making Intel the third largest supplier of cellular baseband chips behind Qualcomm and Mediatek.
To read the full article, click here
Related Semiconductor IP
- P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- MIPI SoundWire I3S Peripheral IP
- LPDDR6/5X/5 Controller IP
- Post-Quantum ML-KEM IP Core
Related News
- iPhone 7: Will It Have Intel Inside?
- iPhone 7 Materials Costs Higher than Previous Versions, IHS Markit Teardown Reveals
- Intel Launches Agilex 7 FPGAs with R-Tile, First FPGA with PCIe 5.0 and CXL Capabilities
- Intel, TSMC to detail 2nm processes at IEDM
Latest News
- ADTechnology Collaborates with Euclyd to Develop Ultra-Efficient AI Chip for Datacenters
- SEALSQ and IC’Alps Unify Expertise to Deliver Integrated Post-Quantum Cybersecurity and Functional Safety for Autonomous Vehicles
- PUFsecurity’s PUFrt Anchors the Security of Silicon Labs’ SoC to Achieve the Industry’s First PSA Certified Level 4
- The next RISC-V processor frontier: AI
- PQShield joins EU-funded FORTRESS Project: Pioneering Quantum-Safe Secure Boot for Europe’s Digital Future